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Title: Multilayer capacitors, method for making multilayer capacitors

Patent ·
OSTI ID:1425940
;

The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-06CH11357
Assignee:
UChicago Argonne, LLC (Chicago, IL)
Patent Number(s):
9,908,817
Application Number:
13/528,544
OSTI ID:
1425940
Resource Relation:
Patent File Date: 2012 Jun 20
Country of Publication:
United States
Language:
English

References (22)

Method of Fabricating Multilayer Ceramic Capacitors patent August 1972
High dielectric multilayer capacitor patent August 1989
Packaged electrical component patent March 1995
High capacitance thin film capacitor patent October 1995
High power capacitor patent April 1997
Multi-layer film capacitor structures and method patent April 1998
Nonlinear optical materials and process for producing the same patent September 1998
Capacitor module, bank of such modules, and storehouse housing such banks patent April 2001
Capacitor stack structure and method of fabricating description patent January 2002
Method of manufacturing dielectric ceramic composition and electronic device containing dielectric layer patent November 2002
Dielectric ceramic and monolithic ceramic capacitor including same patent December 2004
Thin film dielectrics for capacitors and methods of making thereof patent April 2006
Multi-level thin film capacitor on a ceramic substrate patent May 2007
Method for fabricating dielectric capacitor patent-application September 2001
Silicon carbide semiconductor device and its manufacturing method patent-application June 2003
Capacitor and a process for electrically connecting electrode layers to a point of connection patent-application June 2003
Process for the producing of electrolytic capacitors patent-application November 2005
Method and apparatus for a capacitor shell including two mateable cupped components patent-application January 2006
Method for Fabrication of Ceramic Dielectric Films on Copper Foils patent-application December 2010
Improved dielectric properties of lead zirconate titanate thin films deposited on metal foils with LaNiO3 buffer layers journal February 2001
Evolution of materials technology for stacked-capacitors in 65nm embedded-DRAM journal November 2005
Chemical solution deposition of ferroelectric lead lanthanum zirconate titanate films on base-metal foils journal January 2008

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