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Title: Characterization of LaRC-CPI semicrystalline polyimide using thermal, dynamic mechanical and dielectric relaxation techniques

Conference ·
OSTI ID:141876
; ; ;  [1]
  1. Massachusetts Institute of Technology, Cambridge, MA (United States)

The thermal, dynamic mechanical, and dielectric properties of the semicrystalline thermoplastic polyimide LaRC-CPI were studied. Using differential scanning calorimetry to measure heats of fusion and WAXS to measure crystallinity, the heat of fusion of perfect crystalline LaRC-CPI was determined to be 92 {+-} 2 J/g. DMA and dielectric measurements were performed on three LaRC-CPI films (as received, annealed, and amorphous). Crystallinity was found to reinforce the rubbery state resulting in a higher modulus and broader distribution of relaxation times. Broader relaxation for the crystalline LaRC-CPI was also observed in the dielectric tests. Processing strain and the thermal history were found to have a significant impact in both dynamic mechanical and dielectric relaxation measurements.

OSTI ID:
141876
Report Number(s):
CONF-930304-; TRN: 93:003688-1564
Resource Relation:
Conference: 205. American Chemical Society national meeting, Denver, CO (United States), 28 Mar - 2 Apr 1993; Other Information: PBD: 1993; Related Information: Is Part Of 205th ACS national meeting; PB: 1951 p.
Country of Publication:
United States
Language:
English