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Title: Contact Drying of Printed Sinterable-Silver Paste

Abstract

We report that drying of stencil-, screen-, or dispense-printed paste is a crucial, yet taken-for-granted, presintering step for sinterable-silver (SS) interconnect processing and ultimately its reliability. If the paste’s solvent is not sufficiently removed during drying, then entrapped gas can result, and that leads to the formation of thermal-, strength-, and reliability-limiting defects in the later-sintered interconnect layer. Presently advocated drying strategies for wet silver paste cause either a limit of associated size or area or require pressure assistance during subsequent sintering. Alternatively, open-face contact drying (OContDry) from contact heating or conductive heating (a method used in industrial processes) offers the potential to overcome those limitations with SS paste. However, satisfactory strength of its final sintered structure must be proven prior to any potential adoption. In this paper, the achievement of a combination of relatively large shear failure stress with low scatter for OContDry SS was demonstrated. Lastly, this is significant because OContDry enables greater processing versatility with SS interconnects and several other advantages too.

Authors:
ORCiD logo [1];  [1];  [1];  [2]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Materials Science and Technology Division
  2. Alfred Univ., NY (United States). Ceramic Engineering and Glass Science Engineering Program
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1415206
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Journal Article
Journal Name:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
Additional Journal Information:
Journal Volume: 7; Journal Issue: 12; Journal ID: ISSN 2156-3950
Publisher:
IEEE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Conductive drying; interconnects; open-face contact drying (OContDry); open-face convective drying (OVectDry); sintered silver (SS)

Citation Formats

Wereszczak, Andrew A., Modungo, Max C., Chen, Branndon R., and Carty, William M. Contact Drying of Printed Sinterable-Silver Paste. United States: N. p., 2017. Web. doi:10.1109/TCPMT.2017.2752140.
Wereszczak, Andrew A., Modungo, Max C., Chen, Branndon R., & Carty, William M. Contact Drying of Printed Sinterable-Silver Paste. United States. doi:10.1109/TCPMT.2017.2752140.
Wereszczak, Andrew A., Modungo, Max C., Chen, Branndon R., and Carty, William M. Mon . "Contact Drying of Printed Sinterable-Silver Paste". United States. doi:10.1109/TCPMT.2017.2752140.
@article{osti_1415206,
title = {Contact Drying of Printed Sinterable-Silver Paste},
author = {Wereszczak, Andrew A. and Modungo, Max C. and Chen, Branndon R. and Carty, William M.},
abstractNote = {We report that drying of stencil-, screen-, or dispense-printed paste is a crucial, yet taken-for-granted, presintering step for sinterable-silver (SS) interconnect processing and ultimately its reliability. If the paste’s solvent is not sufficiently removed during drying, then entrapped gas can result, and that leads to the formation of thermal-, strength-, and reliability-limiting defects in the later-sintered interconnect layer. Presently advocated drying strategies for wet silver paste cause either a limit of associated size or area or require pressure assistance during subsequent sintering. Alternatively, open-face contact drying (OContDry) from contact heating or conductive heating (a method used in industrial processes) offers the potential to overcome those limitations with SS paste. However, satisfactory strength of its final sintered structure must be proven prior to any potential adoption. In this paper, the achievement of a combination of relatively large shear failure stress with low scatter for OContDry SS was demonstrated. Lastly, this is significant because OContDry enables greater processing versatility with SS interconnects and several other advantages too.},
doi = {10.1109/TCPMT.2017.2752140},
journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
issn = {2156-3950},
number = 12,
volume = 7,
place = {United States},
year = {2017},
month = {10}
}