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Title: The Role of Grain Boundary Orientation on Void Nucleation in Tantalum

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  1. Los Alamos National Laboratory
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Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE Laboratory Directed Research and Development (LDRD) Program
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Conference: 20th Biennial Conference of the APS Topical Group on Shock Compression of Condensed Matter ; 2017-07-09 - 2017-07-09 ; St. Louis, Missouri, United States
Country of Publication:
United States
Tantalum, MD, Spall

Citation Formats

Hahn, Eric Nicholas, Fensin, Saryu Jindal, and Germann, Timothy Clark. The Role of Grain Boundary Orientation on Void Nucleation in Tantalum. United States: N. p., 2017. Web.
Hahn, Eric Nicholas, Fensin, Saryu Jindal, & Germann, Timothy Clark. The Role of Grain Boundary Orientation on Void Nucleation in Tantalum. United States.
Hahn, Eric Nicholas, Fensin, Saryu Jindal, and Germann, Timothy Clark. Tue . "The Role of Grain Boundary Orientation on Void Nucleation in Tantalum". United States. doi:.
title = {The Role of Grain Boundary Orientation on Void Nucleation in Tantalum},
author = {Hahn, Eric Nicholas and Fensin, Saryu Jindal and Germann, Timothy Clark},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 12 00:00:00 EST 2017},
month = {Tue Dec 12 00:00:00 EST 2017}

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  • For ductile metals, dynamic fracture during shock loading is thought to occur through void nucleation, growth, and then coalescence that leads to material failure. Particularly for high purity metals, it has been observed by numerous investigators that, under incipient spall conditions, voids appear to heterogeneously nucleate at some grain boundaries, but not others. Several factors can affect the void nucleation stress at a grain boundary, such as grain boundary structure, orientation with respect to the loading direction, energy and excess volume, in addition to its interactions with dislocations. In this work, we focus on the influence of loading direction withmore » respect to the grain boundary plane and grain boundary properties such as energy and excess volume on the stress required for void nucleation of a grain boundary, in copper from moleculardynamics simulations. Flyer plate simulations were carried out for four boundary types with different energies and excess volumes. These boundaries were chosen as model systems to represent various boundaries observed in “real” materials. Simulations indicate that there is no direct correlation between the void nucleation stress at a boundary and either its energy and excess volume. This result suggests that average properties of grain boundaries alone are not sufficient indicators of the spall strength of a boundary and perhaps local boundary properties need to be taken into account in order to predict its susceptibility to void nucleation for broad ranges of materials. We also present both experimental and simulation results corresponding to the affect of orientation on void nucleation.« less
  • The mechanical properties of the silicon carbide (SiC) layer of the TRi-ISOtropic (TRISO) coated particle (CP) for high temperature gas reactors (HTGR) are performance parameters that have not yet been standardized by the international HTR community. Presented in this paper are the results of characterizing coated particles to reveal the effect of annealing temperature (1000 to 2100°C) on the strength and grain size of unirradiated coated particles. This work was further expanded to include possible relationships between the grain size and strength values. The comparative results of two strength measurement techniques and grain size measured by the Lineal intercept methodmore » are included. Preliminary grain boundary characterization results determined by electron backscatter diffraction (EBSD) are included. These results are also important for future fission product transport studies, as grain boundary diffusion is identified as a possible mechanism by which 110mAg, one of the fission activation products, might be released through intact SiC layers. Temperature is a parameter known to influence the grain size of SiC and therefore it is important to investigate the effect of high temperature annealing on the SiC grain size. Recommendations and future work will also be briefly discussed.« less
  • Abstract not provided.