Vertically Integrated Edgeless Photon Imaging Camera

Conference · Sun Jan 01 00:00:00 EST 2017

OSTI ID:1412507

Fahim, Farah ^[1]; Deptuch, Grzegorz ^[1]; Shenai, Alpana ^[1]; Maj, Piotr ^[2]; Kmon, Piotr ^[2]; Grybos, Pawel ^[2]; Szczygiel, Robert ^[2]; Siddons, D. Peter ^[3]; Rumaiz, Abdul ^[3]; Kuczewski, Anthony ^[3]; Mead, Joseph ^[3]; Bradford, Rebecca ^[4]; Weizeorick, John ^[4]

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1. Fermilab
2. AGH-UST, Cracow
3. Brookhaven
4. Argonne

The Vertically Integrated Photon Imaging Chip - Large, (VIPIC-L), is a large area, small pixel (65μm), 3D integrated, photon counting ASIC with zero-suppressed or full frame dead-time-less data readout. It features data throughput of 14.4 Gbps per chip with a full frame readout speed of 56kframes/s in the imaging mode. VIPIC-L contain 192 x 192 pixel array and the total size of the chip is 1.248cm x 1.248cm with only a 5μm periphery. It contains about 120M transistors. A 1.3M pixel camera module will be developed by arranging a 6 x 6 array of 3D VIPIC-L’s bonded to a large area silicon sensor on the analog side and to a readout board on the digital side. The readout board hosts a bank of FPGA’s, one per VIPIC-L to allow processing of up to 0.7 Tbps of raw data produced by the camera.

• Research Organization: Argonne National Lab. (ANL), Argonne, IL (United States); Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States); Brookhaven National Lab. (BNL), Upton, NY (United States)
• Sponsoring Organization: USDOE Office of Science (SC), High Energy Physics (HEP)
• DOE Contract Number: AC02-07CH11359
• OSTI ID: 1412507
• Report Number(s): FERMILAB-CONF-17-128-PPD; 1641008
• Country of Publication: United States
• Language: English