The structure of a copper adlayer at a solid-liquid interface, Au(III) in sulfuric acid
- IBM Research Division, San Jose, CA (United States)
- Atomic Energy of Canada, Ontario (Canada)
A stable adlayer of copper can be deposited electrochemically on gold from sulfuric acid solutions at potentials positive of the thermodynamically reversible potential, so called underpotential deposition. On the Au(III) surface, Cu underpotentially deposits in two stages, the structures of which are controversial even though they have been examined ex situ using LEED and RIIEED, and in situ using STM, AFM, and EXAFS. New surface ESAFS data and simultaneous charge and mass coverage data obtained with an oscillating quartz crystal microbalance demonstrates that copper deposition is complicated by sulfate (or bisulfate) coadsorption and that the Cu coverage at the first stage is high than the 1/3 coverage of a {radical}3 x {radical}3 arrangement of Cu atoms deduced from the STM pictures. The authors believe the first stage structure is more complex and will discuss possible models. The data is consistent with a 1 x 1 Cu adlayer for the second stage.
- OSTI ID:
- 141098
- Report Number(s):
- CONF-930304--
- Country of Publication:
- United States
- Language:
- English
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