Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper

Journal Article · Wed Oct 04 00:00:00 EDT 2017 · Advanced Functional Materials

DOI:https://doi.org/10.1002/adfm.201703265· OSTI ID:1396415

Palko, James W. ^[1]; Lee, Hyoungsoon ^[2]; Zhang, Chi ^[3]; Dusseault, Tom J. ^[3]; Maitra, Tanmoy ^[3]; Won, Yoonjin ^[4]; Agonafer, Damena D. ^[5]; Moss, Jess ^[3]; Houshmand, Farzad ^[3]; Rong, Guoguang ^[6]; Wilbur, Joshua D. ^[3]; Rockosi, Derrick ^[7]; Mykyta, Ihor ^[7]; Resler, Dan ^[7]; Altman, David ^[7]; Asheghi, Mehdi ^[3]; Santiago, Juan G. ^[3]; Goodson, Kenneth E. ^[3]

---

1. Department of Mechanical Engineering Stanford University Stanford CA 94305 USA, Department of Mechanical Engineering University of California Merced Merced CA 95340 USA
2. School of Mechanical Engineering Chung‐Ang University Seoul 06974 South Korea
3. Department of Mechanical Engineering Stanford University Stanford CA 94305 USA
4. Department of Mechanical and Aerospace Engineering University of California Irvine Irvine CA 92697 USA
5. Department of Mechanical Engineering and Materials Science Washington University St. Louis MO 63130 USA
6. Electronics and Communication Engineering Department Suzhou Vocational Institute of Industrial Technology Suzhou 215021 China
7. Advanced Technology Programs Raytheon Integrated Defense Systems Sudbury MA 01776 USA

Abstract This paper reports the first integration of laser‐etched polycrystalline diamond microchannels with template‐fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 µm and 5 µm pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm ⁻² of heat removal from 0.7 cm ² surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 × 10 ⁵ W m ⁻² K ⁻¹ . This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm ⁻² over 200 µm × 200 µm with <3 K temperature difference). A microfluidic manifold assures uniform distribution of liquid over the heat sink surface with negligible pumping power requirements (e.g., <1.4 × 10 ⁻⁴ of the thermal power dissipated). This breakthrough integration of functional materials and the resulting experimental data set a very high bar for microfluidic heat removal.

• Sponsoring Organization: USDOE
• Grant/Contract Number: HR0011‐13‐2‐0011
• OSTI ID: 1396415
• Journal Information: Advanced Functional Materials, Journal Name: Advanced Functional Materials Vol. 27 Journal Issue: 45; ISSN 1616-301X
• Publisher: Wiley Blackwell (John Wiley & Sons)
• Country of Publication: Germany
• Language: English