Methods and devices for fabricating and assembling printable semiconductor elements
Patent
·
OSTI ID:1393416
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
- Research Organization:
- Univ. of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FG02-91ER45439
- Assignee:
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Patent Number(s):
- 9,768,086
- Application Number:
- 15/084,211
- OSTI ID:
- 1393416
- Resource Relation:
- Patent File Date: 2016 Mar 29
- Country of Publication:
- United States
- Language:
- English
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