High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution

Skoug, Eric J.; Cain, Jeffrey D.; Morelli, Donald T.

doi:10.1063/1.3605246

Title: High thermoelectric figure of merit in the Cu ₃ SbSe ₄ -Cu ₃ SbS ₄ solid solution

Journal Article · Mon Jun 27 00:00:00 EDT 2011 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.3605246· OSTI ID:1381174

Skoug, Eric J.; Cain, Jeffrey D.; Morelli, Donald T.

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Research Organization:: Energy Frontier Research Centers (EFRC) (United States). Revolutionary Materials for Solid State Energy Conversion (RMSSEC)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

DOE Contract Number:: SC0001054

OSTI ID:: 1381174

Journal Information:: Applied Physics Letters, Vol. 98, Issue 26; Related Information: RMSSEC partners with Michigan State University (lead); University of California, Los Angeles; University of Michigan; Northwestern University; Oak Ridge National Laboratory; Ohio State University; Wayne State University; ISSN 0003-6951

Publisher:: American Institute of Physics (AIP)

Country of Publication:: United States

Language:: English

References (9)

Improved Thermoelectric Properties of Cu-Doped Quaternary Chalcogenides of Cu ₂ CdSnSe ₄ Liu, Min-Ling; Chen, I-Wei; Huang, Fu-Qiang Advanced Materials, Vol. 21, Issue 37 https://doi.org/10.1002/adma.200900409	journal	October 2009
High thermoelectric figure of merit in heavy hole dominated PbTe Pei, Yanzhong; LaLonde, Aaron; Iwanaga, Shiho Energy & Environmental Science, Vol. 4, Issue 6 https://doi.org/10.1039/c0ee00456a	journal	January 2011
Strain field fluctuation effects on lattice thermal conductivity of ZrNiSn-based thermoelectric compounds Yang, J.; Meisner, G. P.; Chen, L. Applied Physics Letters, Vol. 85, Issue 7 https://doi.org/10.1063/1.1783022	journal	August 2004
Intrinsically Minimal Thermal Conductivity in Cubic $I − V − {VI}_{2}$ Semiconductors Morelli, D. T.; Jovovic, V.; Heremans, J. P. Physical Review Letters, Vol. 101, Issue 3, Article No. 035901 https://doi.org/10.1103/PhysRevLett.101.035901	journal	July 2008
Cu−Se Bond Network and Thermoelectric Compounds with Complex Diamondlike Structure Shi, Xiaoya; Xi, Lili; Fan, Jing Chemistry of Materials, Vol. 22, Issue 22 https://doi.org/10.1021/cm101589c	journal	November 2010
Thermoelectric properties of tetrahedrally bonded wide-gap stannite compounds Cu2ZnSn1−xInxSe4 Shi, X. Y.; Huang, F. Q.; Liu, M. L. Applied Physics Letters, Vol. 94, Issue 12 https://doi.org/10.1063/1.3103604	journal	March 2009
Nanostructures in high-performance (GeTe) _x (AgSbTe ₂ ) _{100− x} thermoelectric materials Yang, S. H.; Zhu, T. J.; Sun, T. Nanotechnology, Vol. 19, Issue 24 https://doi.org/10.1088/0957-4484/19/24/245707	journal	May 2008
Refinement of the crystal structures of Cu3PS4 and Cu3SbS4 and a comment on normal tetrahedral structures Pfitzner, Arno; Reiser, S. Zeitschrift für Kristallographie - Crystalline Materials, Vol. 217, Issue 2 https://doi.org/10.1524/zkri.217.2.51.20632	journal	January 2002
Crystal structure of tricopper tetraselenoantimonate (V), Cu₃SbSe₄ Zeitschrift für Kristallographie - Crystalline Materials, Vol. 209, Issue 8 https://doi.org/10.1524/zkri.1994.209.8.685	journal	August 1994

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Title: High thermoelectric figure of merit in the Cu 3 SbSe 4 -Cu 3 SbS 4 solid solution

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Title: High thermoelectric figure of merit in the Cu ₃ SbSe ₄ -Cu ₃ SbS ₄ solid solution