Deformation response of AgCu interfaces investigated by in situ and ex situ TEM straining and MD simulations

Eftink, Benjamin P.; Li, Ao; Szlufarska, I.; Mara, Nathan Allan; Robertson, Ian M.

doi:10.1016/j.actamat.2017.07.051

Deformation response of AgCu interfaces investigated by in situ and ex situ TEM straining and MD simulations

Journal Article · Sat Jul 29 00:00:00 EDT 2017 · Acta Materialia

DOI:https://doi.org/10.1016/j.actamat.2017.07.051· OSTI ID:1374358

^[1]; Li, Ao ^[2]; Szlufarska, I. ^[2]; ^[3]; Robertson, Ian M. ^[2]

Univ. of Illinois, Urbana, IL (United States)
Univ. of Wisconsin, Madison, WI (United States)
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

The mechanisms of strain transfer across Ag/Cu interfaces were determined by a combination of in situ and ex situ TEM straining experiments and molecular dynamics simulations. Minimizing the magnitude of the Burgers vector of the residual dislocation generated in the interface was the dominant factor for determining the outcome of dislocation and deformation twin interactions with both non-coherent twin and cube-on-cube interfaces. This included the unexpected finding, due to the loading condition, of deformation twin activation in the Cu layer due to the intersection of deformation twins in Ag with the interface. As a result, deformation twin nucleation in Ag from the non-coherent twin interfaces was also explained by a Burgers vector minimization argument.

View Accepted Manuscript (DOE)

Research Organization:: Los Alamos National Laboratory (LANL)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC52-06NA25396; FG02-07ER46443

OSTI ID:: 1374358

Alternate ID(s):: OSTI ID: 1549639

Report Number(s):: LA-UR-17-23996

Journal Information:: Acta Materialia, Journal Name: Acta Materialia Journal Issue: C Vol. 138; ISSN 1359-6454

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

References (39)

Fine Structure of Weak Kinematical Electron Diffraction Beams for a Foil Containing Stacking Fault or Anti-Phase Boundaries - Two-Beam Case Gevers, R.; van Landuyt, J.; Amelinckx, S. physica status solidi (b), Vol. 23, Issue 2 https://doi.org/10.1002/pssb.19670230214	journal	January 1967
Fast Parallel Algorithms for Short-Range Molecular Dynamics Plimpton, Steve Journal of Computational Physics, Vol. 117, Issue 1 https://doi.org/10.1006/jcph.1995.1039	journal	March 1995
AnIn Situ transmission electron microscope deformation study of the slip transfer mechanisms in metals Lee, T. C.; Robertson, I. M.; Birnbaum, H. K. Metallurgical Transactions A, Vol. 21, Issue 9 https://doi.org/10.1007/BF02646988	journal	September 1990
The effect of grain size on the high-strain, high-strain-rate behavior of copper Meyers, Marc A.; Andrade, Umberto R.; Chokshi, Atul H. Metallurgical and Materials Transactions A, Vol. 26, Issue 11 https://doi.org/10.1007/BF02669646	journal	November 1995
Compatibility of deformation in two-phase Ti-Al alloys: Dependence on microstructure and orientation relationships Luster, J.; Morris, M. A. Metallurgical and Materials Transactions A, Vol. 26, Issue 7 https://doi.org/10.1007/BF02670762	journal	July 1995
Slip transfer and dislocation nucleation processes in multiphase ordered Ni-Fe-Al alloys Misra, A.; Gibala, R. Metallurgical and Materials Transactions A, Vol. 30, Issue 4 https://doi.org/10.1007/s11661-999-0152-3	journal	April 1999
Grain Boundary Responses to Heterogeneous Deformation in Tantalum Polycrystals Bieler, Thomas R.; Sutton, Scott C.; Dunlap, Bret E. JOM, Vol. 66, Issue 1 https://doi.org/10.1007/s11837-013-0821-y	journal	November 2013
Effect of residual strain on the substructure development and mechanical response of shock-loaded copper Gray, G. T.; Follansbee, P. S.; Frantz, C. E. Materials Science and Engineering: A, Vol. 111 https://doi.org/10.1016/0921-5093(89)90192-5	journal	May 1989
On the criteria for slip transmission across interfaces in polycrystals Clark, W. A. T.; Wagoner, R. H.; Shen, Z. Y. Scripta Metallurgica et Materialia, Vol. 26, Issue 2 https://doi.org/10.1016/0956-716X(92)90173-C	journal	January 1992
Effect of grain size and pressure on twinning and microbanding in oblique shock loading of copper rods Sanchez, J. C.; Murr, L. E.; Staudhammer, K. P. Acta Materialia, Vol. 45, Issue 8 https://doi.org/10.1016/S1359-6454(97)00018-9	journal	August 1997
Molecular dynamics simulation of fast dislocations in copper Tsuzuki, Hélio; Branicio, Paulo Sergio; Rino, José Pedro Acta Materialia, Vol. 57, Issue 6 https://doi.org/10.1016/j.actamat.2008.12.025	journal	April 2009
Orientation dependence of shock-induced twinning and substructures in a copper bicrystal Cao, Fang; Beyerlein, Irene J.; Addessio, Francis L. Acta Materialia, Vol. 58, Issue 2 https://doi.org/10.1016/j.actamat.2009.09.033	journal	January 2010
Severe deformation twinning in pure copper by cryogenic wire drawing Kauffmann, A.; Freudenberger, J.; Geissler, D. Acta Materialia, Vol. 59, Issue 20 https://doi.org/10.1016/j.actamat.2011.08.042	journal	December 2011
Interface mediated mechanisms of plastic strain recovery in a AgCu alloy Eftink, B. P.; Li, A.; Szlufarska, I. Acta Materialia, Vol. 117 https://doi.org/10.1016/j.actamat.2016.07.010	journal	September 2016
Dislocation interactions with grain boundaries Kacher, Josh; Eftink, B. P.; Cui, B. Current Opinion in Solid State and Materials Science, Vol. 18, Issue 4 https://doi.org/10.1016/j.cossms.2014.05.004	journal	August 2014
Texture evolution via combined slip and deformation twinning in rolled silver–copper cast eutectic nanocomposite Beyerlein, Irene J.; Mara, Nathan A.; Bhattacharyya, Dhriti International Journal of Plasticity, Vol. 27, Issue 1 https://doi.org/10.1016/j.ijplas.2010.05.007	journal	January 2011
Slip transfer across grain boundaries in Fe–Si bicrystals Gemperlová, J.; Polcarová, M.; Gemperle, A. Journal of Alloys and Compounds, Vol. 378, Issue 1-2 https://doi.org/10.1016/j.jallcom.2003.10.086	journal	September 2004
Slip transmission in bcc FeCr polycrystal Patriarca, Luca; Abuzaid, Wael; Sehitoglu, Huseyin Materials Science and Engineering: A, Vol. 588 https://doi.org/10.1016/j.msea.2013.08.050	journal	December 2013
Quasi-static and dynamic compressive deformation of a bulk nanolayered Ag–Cu eutectic alloy: Macroscopic response and dominant deformation mechanisms Kingstedt, O. T.; Eftink, B.; Lambros, J. Materials Science and Engineering: A, Vol. 595 https://doi.org/10.1016/j.msea.2013.11.061	journal	February 2014
Anomalous deformation twinning in coarse-grained Cu in Ag60Cu40 composites under high strain-rate compressive loading Eftink, B. P.; Mara, N. A.; Kingstedt, O. T. Materials Science and Engineering: A, Vol. 618 https://doi.org/10.1016/j.msea.2014.08.082	journal	November 2014
Defect-interface interactions Beyerlein, I. J.; Demkowicz, M. J.; Misra, A. Progress in Materials Science, Vol. 74 https://doi.org/10.1016/j.pmatsci.2015.02.001	journal	October 2015
Slip resistance of interfaces and the strength of metallic multilayer composites Hoagland, R. G.; Kurtz, R. J.; Henager, C. H. Scripta Materialia, Vol. 50, Issue 6 https://doi.org/10.1016/j.scriptamat.2003.11.059	journal	March 2004
Interface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites Wang, Jian; Beyerlein, Irene J.; Mara, Nathan A. Scripta Materialia, Vol. 64, Issue 12 https://doi.org/10.1016/j.scriptamat.2011.02.025	journal	June 2011
Critique of mechanisms of formation of deformation, annealing and growth twins: Face-centered cubic metals and alloys Mahajan, S. Scripta Materialia, Vol. 68, Issue 2 https://doi.org/10.1016/j.scriptamat.2012.09.011	journal	January 2013
Stability of interfaces in a multilayered Ag–Cu composite during cold rolling Tian, Y. Z.; Zhang, Z. F. Scripta Materialia, Vol. 68, Issue 7 https://doi.org/10.1016/j.scriptamat.2012.12.014	journal	April 2013
Location specific in situ TEM straining specimens made using FIB Field, R. D.; Papin, P. A. Ultramicroscopy, Vol. 102, Issue 1 https://doi.org/10.1016/j.ultramic.2004.08.002	journal	December 2004
Low‐Temperature Deformation of Copper Single Crystals Blewitt, T. H.; Coltman, R. R.; Redman, J. K. Journal of Applied Physics, Vol. 28, Issue 6 https://doi.org/10.1063/1.1722824	journal	June 1957
Bulk nanostructured alloys prepared by flux melting and melt solidification Shen, T. D.; Schwarz, R. B.; Zhang, X. Applied Physics Letters, Vol. 87, Issue 14 https://doi.org/10.1063/1.2056610	journal	October 2005
Atomic-scale investigation of interface-facilitated deformation twinning in severely deformed Ag-Cu nanolamellar composites An, X. H.; Zhu, S. M.; Cao, Y. Applied Physics Letters, Vol. 107, Issue 1 https://doi.org/10.1063/1.4926370	journal	July 2015
TEM in situ deformation study of the interaction of lattice dislocations with grain boundaries in metals Lee, T. C.; Robertson, I. M.; Birnbaum, H. K. Philosophical Magazine A, Vol. 62, Issue 1 https://doi.org/10.1080/01418619008244340	journal	July 1990
The role of the α ₂ phase in the transmission of slip in lamellar TiAl-based alloys Godfrey, A.; Hu, D.; Loretto, M. H. Philosophical Magazine A, Vol. 77, Issue 2 https://doi.org/10.1080/01418619808223753	journal	February 1998
In situ straining investigation of slip transfer across α ₂ lamellae at room temperature in a lamellar TiAl alloy Singh, J. B.; Molénat, G.; Sundararaman, M. Philosophical Magazine Letters, Vol. 86, Issue 1 https://doi.org/10.1080/09500830500497066	journal	January 2006
Interactions of dislocations with disconnections in fcc metallic nanolayered materials Henager, C. H.; Kurtz, Richard J.; Hoagland, Richard G. Philosophical Magazine, Vol. 84, Issue 22 https://doi.org/10.1080/14786430410001678235	journal	August 2004
The measurement of stacking-fault energies of pure face-centred cubic metals Cockayne, D. J. H.; Jenkins, M. L.; Ray, I. L. F. Philosophical Magazine, Vol. 24, Issue 192 https://doi.org/10.1080/14786437108217419	journal	December 1971
Twinnability of bimetal interfaces in nanostructured composites Beyerlein, I. J.; Wang, J.; Kang, K. Materials Research Letters, Vol. 1, Issue 2 https://doi.org/10.1080/21663831.2013.782074	journal	February 2013
An embedded-atom potential for the Cu–Ag system Williams, P. L.; Mishin, Y.; Hamilton, J. C. Modelling and Simulation in Materials Science and Engineering, Vol. 14, Issue 5 https://doi.org/10.1088/0965-0393/14/5/002	journal	May 2006
Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool Stukowski, Alexander Modelling and Simulation in Materials Science and Engineering, Vol. 18, Issue 1 https://doi.org/10.1088/0965-0393/18/1/015012	journal	December 2009
Double-inverse grain size dependence of deformation twinning in nanocrystalline Cu Zhang, Jin-Yu; Liu, Gang; Wang, Rui Hong Physical Review B, Vol. 81, Issue 17 https://doi.org/10.1103/PhysRevB.81.172104	journal	May 2010
Effect of Rotation Relationship Between γ Grains on Compatibility of Deformation of Ti-A1 Alloys Morris, M. A.; Luster, J. MRS Proceedings, Vol. 364 https://doi.org/10.1557/PROC-364-593	journal	January 1994

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Effect of cooling rate on the structure and nanotribology of Ag–Cu nano-eutectic alloys Kwon, S. K.; Kim, H. D.; Pei, X. Q. Journal of Materials Science, Vol. 54, Issue 12 https://doi.org/10.1007/s10853-019-03533-5	journal	March 2019
Effect of cooling rate on the structure and nanotribology of Ag–Cu nano-eutectic alloys Kwon, S. K.; Kim, H. D.; Pei, X. Q. Universität des Saarlandes https://doi.org/10.22028/d291-29328	collection	January 2019

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Deformation response of AgCu interfaces investigated by in situ and ex situ TEM straining and MD simulations

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