Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes
Journal Article
·
· Physical Review Letters
- Carnegie Mellon Univ., Pittsburgh, PA (United States). Dept. of Mechanical Engineering; DOE/OSTI
- Carnegie Mellon Univ., Pittsburgh, PA (United States). Dept. of Mechanical Engineering. Dept. of Physics
We generalize the conditions for stable electrodeposition at isotropic solid-solid interfaces using a kinetic model which incorporates the effects of stresses and surface tension at the interface. We develop a stability diagram that shows two regimes of stability: a previously known pressure-driven mechanism and a new density-driven stability mechanism that is governed by the relative density of metal in the two phases. We show that inorganic solids and solid polymers generally do not lead to stable electrodeposition, and provide design guidelines for achieving stable electrodeposition.
- Research Organization:
- 24M Technologies, Inc., Cambridge, MA (United States); Carnegie Mellon Univ., Pittsburgh, PA (United States); Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
- Sponsoring Organization:
- USDOE; USDOE Advanced Research Projects Agency - Energy (ARPA-E); USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office
- Grant/Contract Number:
- AR0000774; EE0007810
- OSTI ID:
- 1536538
- Alternate ID(s):
- OSTI ID: 1881504
OSTI ID: 1374071
- Journal Information:
- Physical Review Letters, Journal Name: Physical Review Letters Journal Issue: 5 Vol. 119; ISSN 0031-9007
- Publisher:
- American Physical Society (APS)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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