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Title: Initiated chemical vapor deposition polymers for high peak-power laser targets

Journal Article · · Thin Solid Films
 [1];  [1];  [1];  [1];  [1];  [1];  [1];  [2];  [3]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
  2. Univ. of Connecticut, Storrs, CT (United States); Kansas State Univ., Manhattan, KS (United States)
  3. Univ. of Connecticut, Storrs, CT (United States)
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Here, we report two examples of initiated chemical vapor deposition (iCVD) polymers being developed for use in laser targets for high peak-power laser systems. First, we show that iCVD poly(divinylbenzene) is more photo-oxidatively stable than the plasma polymers currently used in laser targets. Thick layers (10–12 μm) of this highly crosslinked polymer can be deposited with near-zero intrinsic film stress. Second, we show that iCVD epoxy polymers can be crosslinked after deposition to form thin adhesive layers for assembling precision laser targets. The bondlines can be made as thin as ~ 1 μm, approximately a factor of 2 thinner than achievable using viscous resin-based adhesives. These bonds can withstand downstream coining and stamping processes.

Research Organization:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE Laboratory Directed Research and Development (LDRD) Program
Grant/Contract Number:
AC52-07NA27344; 15-ERD-020
OSTI ID:
1368016
Alternate ID(s):
OSTI ID: 1550637
Report Number(s):
LLNL-JRNL-703180
Journal Information:
Thin Solid Films, Vol. 635, Issue C; ISSN 0040-6090
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 5 works
Citation information provided by
Web of Science

References (16)

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Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies journal April 2015
Analysis of Bi-Metal Thermostats journal January 1925

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Related Subjects

36 MATERIALS SCIENCE
Initiated chemical vapor deposition
Polymers
Thin films
Stress
Adhesives