On the integration of ultrananocrystalline diamond (UNCD) with CMOS chip
- Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA
- Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois 60439, USA, Now with Department of Materials Science and Engineering, University of Texas-Dallas, Richardson, Texas 75080, USA
- Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois 60439, USA
- Department Engineering Physics, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA
- Packaging Solutions Development, Freescale Semiconductor, Inc., 1300 N Alma School Rd, Chandler, Arizona 85224, USA
Not Available
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC02-06CH11357
- OSTI ID:
- 1361805
- Alternate ID(s):
- OSTI ID: 1421014
OSTI ID: 1360136
- Journal Information:
- AIP Advances, Journal Name: AIP Advances Journal Issue: 3 Vol. 7; ISSN AAIDBI; ISSN 2158-3226
- Publisher:
- American Institute of PhysicsCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Similar Records
Development of ultrananocrystalline diamond (UNCD) coatings for multipurpose mechanical pump seals.
Journal Article
·
Fri Dec 31 23:00:00 EST 2010
· Wear
·
OSTI ID:1009367