Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
Patent
·
OSTI ID:1356196
Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
- Research Organization:
- The Board of Trustees of the University of Illinois, Urbana, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FG02-07ER46471; FG02-07ER46453
- Assignee:
- The Board of Trustees of the University of Illinois
- Patent Number(s):
- 9,647,171
- Application Number:
- 14/479,100
- OSTI ID:
- 1356196
- Country of Publication:
- United States
- Language:
- English
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