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Title: Bipolar resistance switching in Pt/CuO x /Pt via local electrochemical reduction

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4883398· OSTI ID:1355782
 [1];  [2];  [3];  [3];  [3];  [2];  [2];  [1]
  1. Argonne National Lab. (ANL), Argonne, IL (United States). Materials Science Division; Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering
  2. Argonne National Lab. (ANL), Argonne, IL (United States). Materials Science Division
  3. Argonne National Lab. (ANL), Argonne, IL (United States). Nanoscience and Technology Division

We investigated the local changes in copper oxidation state and the corresponding resistance changes in Pt/CuOx/Pt nanoscale heterostructures using x-ray nanoprobe spectro-microscopy and current-voltage characterization. After gentle electroforming, during which the current-voltage behavior remains non-linear, the low resistance state was reached, and we also observed regions of 160 nm width that show an increase in Cu K-alpha fluorescence intensity, indicative of partial reduction of the CuOx. Analysis of the current voltage curves showed that the dominant conduction mechanism is Schottky emission and that the resistance state is correlated with the Schottky barrier height. We also propose that the reversible resistivity change in these Pt/CuOx/Pt heterostructures occurs through local electrochemical reduction leading to change of the Schottky barrier height at the interface between Pt and the reduced CuOx layers and to change of the CuOx resistivity within laterally confined portions of the CuOx layer. Our experiments reveal important insights into the mechanism of resistance switching of Pt/CuOx/Pt performed in a current and voltage regime that does not create a metallic conduction path.

Research Organization:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC02-06CH11357
OSTI ID:
1355782
Journal Information:
Applied Physics Letters, Vol. 104, Issue 24; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 17 works
Citation information provided by
Web of Science

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  • Zhou, P.; Lv, H. B.; Yin, M.
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Cited By (5)

Improvement of memristive properties in CuO films with a seed Cu layer journal February 2019
Bottom-up synthesis of ordered metal/oxide/metal nanodots on substrates for nanoscale resistive switching memory journal May 2016
Conducting mechanisms of forming-free TiW/Cu 2 O/Cu memristive devices journal August 2015
Multistate storage nonvolatile memory device based on ferroelectricity and resistive switching effects of SrBi 2 Ta 2 O 9 films journal April 2018
Stable nonpolar resistive switching characteristics in Cu/Cu-dispersed ZrO 2 /Pt memory devices journal February 2017