Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; King, Charles; Catalano, Massimo; Oh, Jun Kyun; Talib, Ansam J.; Scholar, Ethan A.; Verkhoturov, Stanislav V.; Cagin, Tahir; Sokolov, Alexei V.; Kim, Moon J.; Matin, Kaiser; Narumanchi, Sreekant; Akbulut, Mustafa

doi:10.1021/acsami.7b00093

Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Journal Article · Mon Feb 27 00:00:00 EST 2017 · ACS Applied Materials and Interfaces

DOI:https://doi.org/10.1021/acsami.7b00093· OSTI ID:1349024

Yegin, Cengiz ^[1]; Nagabandi, Nirup ^[2]; Feng, Xuhui ^[3]; King, Charles ^[3]; Catalano, Massimo ^[4]; Oh, Jun Kyun ^[1]; Talib, Ansam J. ^[5]; Scholar, Ethan A. ^[2]; Verkhoturov, Stanislav V. ^[6]; Cagin, Tahir ^[7]; Sokolov, Alexei V. ^[5]; Kim, Moon J. ^[1]; Matin, Kaiser ^[8]; Narumanchi, Sreekant ^[3]; ^[7]

Texas A & M Univ., College Station, TX (United States). Dept. of Materials Science and Engineering
Texas A & M Univ., College Station, TX (United States). Artie McFerrin Dept. of Chemical Engineering
National Renewable Energy Lab. (NREL), Golden, CO (United States)
National Research Council (CNR), Lecce (Italy). Inst. for Microelectronics and Microsystems (IMM); Univ. of Texas-Dallas, Richardson, TX (United States). Materials Science and Engineering Dept.
Texas A & M Univ., College Station, TX (United States). Inst. for Quantum Science and Engineering, Dept. of Physics and Astronomy
Texas A & M Univ., College Station, TX (United States). Dept. of Chemistry
Texas A & M Univ., College Station, TX (United States). Dept. of Materials Science and Engineering; Texas A & M Univ., College Station, TX (United States). Artie McFerrin Dept. of Chemical Engineering
Defense Advanced Research Project Agency (DARPA), Arlington, VA (United States)

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Here in this paper, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix -- which are prepared by chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m.K), which are very high considering their relatively low elastic modulus values on the order of 21.2 to 28.5 GPa. The synergistic combination of these properties lead to the ultra-low total thermal resistivity values in the range of 0.38 to 0.56 mm².K/W for a typical bondline thickness of 30-50 um, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally-induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

View Accepted Manuscript (DOE)

Research Organization:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Organization:: Defense Advanced Research Projects Agency (DARPA); National Science Foundation (NSF); USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1349024

Report Number(s):: NREL/JA--5400-68044

Journal Information:: ACS Applied Materials and Interfaces, Journal Name: ACS Applied Materials and Interfaces Journal Issue: 11 Vol. 9; ISSN 1944-8244

Publisher:: American Chemical Society (ACS)Copyright Statement

Country of Publication:: United States

Language:: English

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