Final Scientific/Technical Report (DOE F 241.3) Next-Generation LED Package Architectures Enabled by Thermally Conductive Transparent Encapsulants
- Momentive Performance Materials Quartz, Inc., Strongsville, OH (United States)
The objective of this program is to generate novel LED package designs that would provide 30% improvement in lumen/$ output. This was to be achieved by improving thermal management in encapsulants/ phosphors to reduce their temperatures. Currently, the heat that is generated during down conversion of blue light to longer wavelengths by the phosphors dispersed in the encapsulant does not have optimum thermal pathways for dissipation due to poor thermal conductivity of the encapsulant material. Additionally, high temperature in the encapsulant during operation is one of the primary failure modes in LED luminaires resulting in much shorter than expected life. The thermal issues manifest in color instability (yellowing, browning), cracking and hot spots in the encapsulant leading to failures. This work explored boron nitride (hBN) as thermal fillers in encapsulants to improve thermal conductivity while minimally impacting optical properties. Various approaches to Boron Nitride (BN) were evaluated and over 380 samples were generated to down select appropriate BN morphologies. We developed a range or BN materials for enabling thermal properties while attempting to minimally impact to optical properties.
- Research Organization:
- Momentive Performance Materials Quartz, Inc., Strongsville, OH (United States)
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- Contributing Organization:
- Lumileds Lighting Company
- DOE Contract Number:
- EE0006675
- OSTI ID:
- 1337777
- Report Number(s):
- MPM-0006675
- Country of Publication:
- United States
- Language:
- English
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