Dy uniform film morphologies on graphene studied with SPA-LEED and STM

McDougall, D.; Hattab, H.; Hershberger, M. T.; Hupalo, M.; Horn von Hoegen, M.; Thiel, P. A.; Tringides, M. C.

doi:10.1016/j.carbon.2016.06.083

Title: Dy uniform film morphologies on graphene studied with SPA-LEED and STM

Journal Article · Fri Jul 01 00:00:00 EDT 2016 · Carbon

DOI:https://doi.org/10.1016/j.carbon.2016.06.083· OSTI ID:1335039

McDougall, D. ^[1]; Hattab, H. ^[1]; Hershberger, M. T. ^[1]; Hupalo, M. ^[1]; Horn von Hoegen, M. ^[2]; Thiel, P. A. ^[1]; Tringides, M. C. ^[1]

Ames Lab. and Iowa State Univ., Ames, IA (United States)
Univ. of Duisburg-Essen, Duisburg (Germany)

The use of graphene for microelectronics and spintronic applications requires strategies for metals to wet graphene and to grow layer-by-layer. This is especially important when metals will be used as electrical contacts or as spin filters. Extensive work in the literature so far has shown that this is very challenging, since practically all metals grow 3D, with multi-height islands forming easily. Reasons for the 3D morphology are the much weaker metal carbon bond when compared to the metal cohesive energy and the role of Coulomb repulsion of the poorly screened charges at the metal graphene interface. We employed the complementary techniques of SPA-LEED and STM to study the growth of Dy on graphene. It was found that under kinetic limitations it is possible to fully cover graphene with a bilayer Dy film, by growing well below room temperature in stepwise deposition experiments. Lastly, the Dy film, however, is amorphous but ways to crystallize it within the 2D morphology are possible, since long range order improves at higher growth temperature.

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Research Organization:: Ames Lab., Ames, IA (United States)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC02-07CH11358; LPDS 2013-04

OSTI ID:: 1335039

Alternate ID(s):: OSTI ID: 1358880

Report Number(s):: IS-J-9090; PII: S0008622316305383

Journal Information:: Carbon, Vol. 108, Issue C; ISSN 0008-6223

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 12 works

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