Influence of grain boundary characteristics on thermal stability in nanotwinned copper

Niu, Rongmei; Han, Ke; Su, Yi-feng; Besara, Tiglet; Siegrist, Theo M.; Zuo, Xiaowei

doi:10.1038/srep31410

Influence of grain boundary characteristics on thermal stability in nanotwinned copper

Journal Article · Fri Aug 12 00:00:00 EDT 2016 · Scientific Reports

DOI:https://doi.org/10.1038/srep31410· OSTI ID:1326644

Niu, Rongmei ^[1]; Han, Ke ^[2]; Su, Yi-feng ^[2]; Besara, Tiglet ^[2]; Siegrist, Theo M. ^[2]; Zuo, Xiaowei ^[3]

Florida State Univ., Tallahassee, FL (United States); None
Florida State Univ., Tallahassee, FL (United States)
Northeastern Univ., Shenyang (China)

High density grain boundaries provide high strength, but may introduce undesirable features, such as high Fermi levels and instability. We investigated the kinetics of recovery and recrystallization of Cu that was manufactured to include both nanotwins (NT) and high-angle columnar boundaries. We used the isothermal Johnson-Mehl-Avrami-Kolmogorov (JMAK) model to estimate activation energy values for recovery and recrystallization and compared those to values derived using the non-isothermal Kissinger equation. The JMAK model hinges on an exponent that expresses the growth mechanism of a material. The exponent for this Cu was close to 0.5, indicating low-dimensional microstructure evolution, which is associated with anisotropic twin coarsening, heterogeneous recrystallization, and high stability. Since this Cu was of high purity, there was a negligible impurity-drag-effect on boundaries. The twin coarsening and heterogeneous recrystallization resulted from migration of high-angle columnar boundaries with their triple junctions in one direction, assisted by the presence of high concentration vacancies at boundaries. Analyses performed by electron energy loss spectroscopy of atomic columns at twin boundaries (TBs) and in the interior showed similar plasma peak shapes and L3 edge positions. As a result, this implies that values for conductivity and Fermi level are equal for atoms at TBs and in the interior.

View Accepted Manuscript (DOE)

Research Organization:: Florida State Univ., Tallahassee, FL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)

Grant/Contract Number:: SC0008832

OSTI ID:: 1326644

Journal Information:: Scientific Reports, Journal Name: Scientific Reports Vol. 6; ISSN 2045-2322

Publisher:: Nature Publishing GroupCopyright Statement

Country of Publication:: United States

Language:: English

References (58)

Atomic mechanisms of grain boundary diffusion: Low versus high temperatures Suzuki, A.; Mishin, Y. Journal of Materials Science, Vol. 40, Issue 12 https://doi.org/10.1007/s10853-005-2678-0	journal	June 2005
Recrystallization of Electrodeposited Copper Thin Films During Annealing Alshwawreh, N.; Militzer, M.; Bizzotto, D. Journal of Electronic Materials, Vol. 39, Issue 11 https://doi.org/10.1007/s11664-010-1342-x	journal	September 2010
A quantitative theory of grain-boundary motion and recrystallization in metals in the presence of impurities Lücke, K.; Detert, K. Acta Metallurgica, Vol. 5, Issue 11 https://doi.org/10.1016/0001-6160(57)90109-8	journal	November 1957
The impurity-drag effect in grain boundary motion Cahn, John W. Acta Metallurgica, Vol. 10, Issue 9 https://doi.org/10.1016/0001-6160(62)90092-5	journal	September 1962
The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C Staker, M. R.; Holt, D. L. Acta Metallurgica, Vol. 20, Issue 4 https://doi.org/10.1016/0001-6160(72)90012-0	journal	April 1972
Stored energy and recrystallization temperature of rolled copper and silver single crystals with defined solute contents Haessner, Frank; Hoschek, Günter; Tölg, Günther Acta Metallurgica, Vol. 27, Issue 9 https://doi.org/10.1016/0001-6160(79)90176-7	journal	September 1979
The influence of glass composition on the crystal growth kinetics of heavy metal fluoride glasses Bansal, N. P.; Bruce, A. J.; Doremus, R. H. Journal of Non-Crystalline Solids, Vol. 70, Issue 3 https://doi.org/10.1016/0022-3093(85)90108-5	journal	April 1985
Recovery revisited Nes, E. Acta Metallurgica et Materialia, Vol. 43, Issue 6 https://doi.org/10.1016/0956-7151(94)00409-9	journal	June 1995
Re-evaluation of the Ibe–Lücke growth selection experiment in a Fe–Si single crystal Verbeken, K.; Kestens, L.; Nave, M. D. Acta Materialia, Vol. 53, Issue 9 https://doi.org/10.1016/j.actamat.2005.02.030	journal	May 2005
Highly textured and twinned Cu films fabricated by pulsed electrodeposition Cui, B. Z.; Han, K.; Xin, Y. Acta Materialia, Vol. 55, Issue 13 https://doi.org/10.1016/j.actamat.2007.04.009	journal	August 2007
A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure Kalu, P. N.; Waryoba, D. R. Materials Science and Engineering: A, Vol. 464, Issue 1-2 https://doi.org/10.1016/j.msea.2007.01.124	journal	August 2007
Thermodynamics and kinetics of grain boundary triple junctions in metals: Recent developments Gottstein, G.; Shvindlerman, L. S.; Zhao, B. Scripta Materialia, Vol. 62, Issue 12 https://doi.org/10.1016/j.scriptamat.2010.03.017	journal	June 2010
On the retardation of grain boundary motion by small particles Gottstein, G.; Shvindlerman, L. S. Scripta Materialia, Vol. 63, Issue 11 https://doi.org/10.1016/j.scriptamat.2010.08.005	journal	November 2010
Superior thermal stability of coherent twin boundaries in nanotwinned metals Zhang, X.; Misra, A. Scripta Materialia, Vol. 66, Issue 11 https://doi.org/10.1016/j.scriptamat.2012.01.026	journal	June 2012
Twin stability in highly nanotwinned Cu under compression, torsion and tension Hodge, A. M.; Furnish, T. A.; Shute, C. J. Scripta Materialia, Vol. 66, Issue 11 https://doi.org/10.1016/j.scriptamat.2012.01.027	journal	June 2012
Strain hardening and softening in nanotwinned Cu Niu, Rongmei; Han, Ke Scripta Materialia, Vol. 68, Issue 12 https://doi.org/10.1016/j.scriptamat.2013.02.051	journal	June 2013
Grain boundary self-diffusion in Cu polycrystals of different purity Surholt, T.; Herzig, Chr. Acta Materialia, Vol. 45, Issue 9 https://doi.org/10.1016/s1359-6454(97)00037-2	journal	September 1997
Grain Boundary Migration in Metals: Recent Developments Gottstein, Günter; Molodov, Dmitri A.; Shvindlerman, Lasar S. Interface Science, Vol. 6, Issue 1/2, p. 7-22 https://doi.org/10.1023/a:1008641617937	journal	February 1998
Defective twin boundaries in nanotwinned metals Wang, Y. Morris; Sansoz, Frederic; LaGrange, Thomas Nature Materials, Vol. 12, Issue 8 https://doi.org/10.1038/nmat3646	journal	May 2013
Structure of electroplated and vapor‐deposited copper films. III. Recrystallization and grain growth Gangulee, A. Journal of Applied Physics, Vol. 45, Issue 9 https://doi.org/10.1063/1.1663855	journal	September 1974
Kinetics of Phase Change. I General Theory Avrami, Melvin The Journal of Chemical Physics, Vol. 7, Issue 12, p. 1103-1112 https://doi.org/10.1063/1.1750380	journal	December 1939
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins Chen, X. H.; Lu, L.; Lu, K. Journal of Applied Physics, Vol. 102, Issue 8 https://doi.org/10.1063/1.2799087	journal	October 2007
Thermal stability of sputtered Cu films with nanoscale growth twins Anderoglu, O.; Misra, A.; Wang, H. Journal of Applied Physics, Vol. 103, Issue 9 https://doi.org/10.1063/1.2913322	journal	May 2008
Topological view of the thermal stability of nanotwinned copper LaGrange, Thomas; Reed, Bryan W.; Wall, Mark Applied Physics Letters, Vol. 102, Issue 1 https://doi.org/10.1063/1.4772589	journal	January 2013
High strength and high electrical conductivity bulk Cu Han ¶, K.; Walsh, R. P.; Ishmaku, A. Philosophical Magazine, Vol. 84, Issue 34 https://doi.org/10.1080/14786430412331293496	journal	December 2004
III. Dislocation densities in some annealed and cold-worked metals from measurements on the X-ray debye-scherrer spectrum Williamson, G. K.; Smallman, R. E. Philosophical Magazine, Vol. 1, Issue 1 https://doi.org/10.1080/14786435608238074	journal	January 1956
Stored energy and electrical resistivity in deformed metals Clarebrough, L. M.; Hargreaves, M. E.; Loretto, M. H. Philosophical Magazine, Vol. 6, Issue 66 https://doi.org/10.1080/14786436108238374	journal	June 1961
The release of energy during annealing of deformed metals Clarebrough, L. M.; Hargreaves, M. E.; West, G. W. Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, Vol. 232, Issue 1189, p. 252-270 https://doi.org/10.1098/rspa.1955.0216	journal	October 1955
The Role of Solute Segregation in Grain Boundary Diffusion Bernardini, J.; Gas, P.; Hondros, E. D. Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 379, Issue 1776 https://doi.org/10.1098/rspa.1982.0011	journal	January 1982
Ultrahigh Strength and High Electrical Conductivity in Copper Lu, L. Science, Vol. 304, Issue 5669 https://doi.org/10.1126/science.1092905	journal	April 2004
Structural and calorimetric investigations during recrystallization of rolled copper Haessner, F. Metals Technology, Vol. 6, Issue 1 https://doi.org/10.1179/030716979803276615	journal	January 1979
Proceedings of SCANNING 99 Chicago, Illinois, USA Sunday, April 11 Youngblom, J. H.; Youngblom, J. J.; Wilkinson, J. Scanning, Vol. 21, Issue 2, p. 53-170 https://doi.org/10.1002/sca.4950210201	journal	March 1999
An Introduction to Electron Energy-Loss Spectroscopy Egerton, Ray F. Electron Energy-Loss Spectroscopy in the Electron Microscope https://doi.org/10.1007/978-1-4615-6887-2_1	book	January 1986
An Introduction to Electron Energy-Loss Spectroscopy Egerton, R. F. Electron Energy-Loss Spectroscopy in the Electron Microscope https://doi.org/10.1007/978-1-4757-5099-7_1	book	January 1996
Phase Transformations in Metals and Alloys Porter, D. A.; Easterling, K. E. CRC Press https://doi.org/10.1007/978-1-4899-3051-4	book	January 1992
The three activation energies with isothermal transformations: applications to metallic glasses Ranganathan, S.; Von Heimendahl, M. Journal of Materials Science, Vol. 16, Issue 9 https://doi.org/10.1007/Bf01113575	journal	September 1981
Recovery revisited Dybkaer, René Accreditation and Quality Assurance, Vol. 10, Issue 6 https://doi.org/10.1007/s00769-005-0922-6	journal	May 2005
Zur kinetik der rekristallisation von kupfer nach tieftemperaturverformung Mengelberg, H. D.; Meixner, M.; Lücke, K. Acta Metallurgica, Vol. 13, Issue 7 https://doi.org/10.1016/0001-6160(65)90148-3	journal	July 1965
Stored energy of 78 K tensile deformed copper crystals Gottstein, G.; Bewerunge, J.; Mecking, H. Acta Metallurgica, Vol. 23, Issue 5 https://doi.org/10.1016/0001-6160(75)90105-4	journal	May 1975
Comparative measurements of the recrystallization energy by different calorimeters Gottstein, G.; Steffen, H.; Hemminger, W. Scripta Metallurgica, Vol. 9, Issue 7 https://doi.org/10.1016/0036-9748(75)90242-2	journal	July 1975
Recrystallization Textures Humphreys, F. J.; Hatherly, M. Recrystallization and Related Annealing Phenomena https://doi.org/10.1016/B978-008044164-1/50016-5	book	January 2004
Crystallization kinetics and the JMAK equation Weinberg, Michael C.; Birnie, Dunbar P.; Shneidman, Vitaly A. Journal of Non-Crystalline Solids, Vol. 219 https://doi.org/10.1016/S0022-3093(97)00261-5	journal	October 1997
Current issues in recrystallization: a review Doherty, R. D.; Hughes, D. A.; Humphreys, F. J. Materials Science and Engineering: A, Vol. 238, Issue 2 https://doi.org/10.1016/S0921-5093(97)00424-3	journal	November 1997
Grain boundary migration: misorientation dependence Gottstein, G.; Molodov, D. A.; Shvindlerman, L. S. Current Opinion in Solid State and Materials Science, Vol. 5, Issue 1 https://doi.org/10.1016/S1359-0286(00)00030-9	journal	January 2001
Grain boundary self-diffusion in Cu polycrystals of different purity Surholt, T.; Herzig, Chr. Acta Materialia, Vol. 45, Issue 9 https://doi.org/10.1016/S1359-6454(97)00037-2	journal	September 1997
Recrystallization Textures Humphreys, F. J.; Hatherly, M. Recrystallization and Related Annealing Phenomena https://doi.org/10.1016/b978-0-08-041884-1.50017-9	book	January 1995
Current issues in recrystallization: A review Doherty, R. D.; Hughes, D. A.; Humphreys, F. J. Materials Today, Vol. 1, Issue 2 https://doi.org/10.1016/s1369-7021(98)80046-1	journal	January 1998
Grain Boundary Migration in Metals: Recent Developments Gottstein, Günter; Molodov, Dmitri A.; Shvindlerman, Lasar S. Interface Science, Vol. 6, Issue 1/2, p. 7-22 https://doi.org/10.1023/A:1008641617937	journal	February 1998
Interaction of Point Defects with Grain Boundaries in fcc Metals Suzuki, A.; Mishin, Y. Interface Science, Vol. 11, Issue 4, p. 425-437 https://doi.org/10.1023/A:1026195911339	journal	October 2003
Kinetics of Phase Change. II Transformation‐Time Relations for Random Distribution of Nuclei Avrami, Melvin The Journal of Chemical Physics, Vol. 8, Issue 2 https://doi.org/10.1063/1.1750631	journal	February 1940
Atomic-scale studies on the effect of boundary coherency on stability in twinned Cu Niu, Rongmei; Han, Ke; Su, Yi-Feng Applied Physics Letters, Vol. 104, Issue 1 https://doi.org/10.1063/1.4861610	journal	January 2014
Atomic mechanism for dislocation emission from nanosized grain boundaries Van Swygenhoven, H.; Derlet, P. M.; Hasnaoui, A. Physical Review B, Vol. 66, Issue 2 https://doi.org/10.1103/PhysRevB.66.024101	journal	June 2002
Calculating the vacancy formation energy in metals: Pt, Pd, and Mo Mattsson, Thomas R.; Mattsson, Ann E. Physical Review B, Vol. 66, Issue 21 https://doi.org/10.1103/PhysRevB.66.214110	journal	December 2002
Isothermal Annealing Effects in Irradiated Copper Overhauser, Albert W. Physical Review, Vol. 90, Issue 3 https://doi.org/10.1103/Physrev.90.393	journal	May 1953
Mechanical properties of MP35N as a reinforcement material for pulsed magnets No authors listed IEEE Transactions on Appiled Superconductivity, Vol. 12, Issue 1 https://doi.org/10.1109/TASC.2002.1018627	journal	March 2002
Phase Transformations in Metals and Alloys Meyrick, G.; Powell, G. W. Annual Review of Materials Science, Vol. 3, Issue 1 https://doi.org/10.1146/annurev.ms.03.080173.001551	journal	August 1973
Nucleation and growth during recrystallization Rios, Paulo Rangel; Siciliano Jr, Fulvio; Sandim, Hugo Ricardo Zschommler Materials Research, Vol. 8, Issue 3 https://doi.org/10.1590/S1516-14392005000300002	journal	September 2005
Variation of peak temperature with heating rate in differential thermal analysis Kissinger, Homer E. Journal of Research of the National Bureau of Standards, Vol. 57, Issue 4 https://doi.org/10.6028/Jres.057.026	journal	October 1956

Cited By (2)

In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films Cheng, Gong; Li, Heng; Xu, Gaowei Scientific Reports, Vol. 7, Issue 1 https://doi.org/10.1038/s41598-017-10096-5	journal	September 2017
Modeling of grain growth under fully anisotropic grain boundary energy Hallberg, Håkan; Bulatov, Vasily V. Modelling and Simulation in Materials Science and Engineering, Vol. 27, Issue 4 https://doi.org/10.1088/1361-651x/ab0c6c	journal	April 2019

Similar Records

Atomic-scale studies on the effect of boundary coherency on stability in twinned Cu

Journal Article · Sun Jan 05 23:00:00 EST 2014 · Applied Physics Letters · OSTI ID:22257756

Modeling recovery and recrystallization kinetics in cold-rolled Ti-Nb stabilized interstitial-free steel

Journal Article · Thu Oct 31 23:00:00 EST 1996 · Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science · OSTI ID:413277

Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements

Journal Article · Fri Jun 07 00:00:00 EDT 2013 · Journal of Applied Physics · OSTI ID:22162998

Related Subjects

36 MATERIALS SCIENCE

Influence of grain boundary characteristics on thermal stability in nanotwinned copper

Citation Formats

References (58)

Cited By (2)

Similar Records

Related Subjects