EFFECT OF METALLIC INTERCONNECT THICKNESS ON ITS LONG-TERM PERFORMANCE IN SOFCS
At the operating environment of solid oxide fuel cells (SOFCs), oxide scale will grow on the ferritic interconnect (IC) surface unavoidably and furfures induce growth stress in oxide scale and along the interface of the oxide scale and IC substrate. A combination of growth stress with thermal stresses may lead to scale delamination/buckling and eventual spallation during SOFC stack cooling, even leading to serious degradation of cell performance. In this paper, the effect of the ferritic IC thickness on the delamination/spallation of the oxide scale was investigated numerically. The predicted results show that the interfacial shear stresses increase with the growth of the oxide scale and also with the thickness of the ferritic substrate; i.e., the thick ferritic substrate can easily lead to scale delamination and spallation.
- Research Organization:
- Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-76RL01830
- OSTI ID:
- 1324928
- Report Number(s):
- PNNL-SA-76987; AA6040000
- Resource Relation:
- Conference: Advances in Solid Oxide Fuel Cells VII: Ceramic Engineering and Science Proceedings, January 23-28, 2011, Daytona Beach, Florida, 32:131-138
- Country of Publication:
- United States
- Language:
- English
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