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Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films.

Conference ·
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1319745
Report Number(s):
SAND2014-19489C; 541011
Country of Publication:
United States
Language:
English

References (27)

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Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration journal April 2013
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Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits journal November 2005
Overview no. 35 Dynamic recrystallization: Mechanical and microstructural considerations journal February 1984
Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms journal May 2013
Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films journal August 1999
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Stress and grain growth in thin films journal May 1996
Reversible stress changes at all stages of Volmer–Weber film growth journal February 2004
Dynamic recrystallization of Cu single crystals during tensile deformation in creep journal October 1983
Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films journal March 2011
A Practical Viscoplastic Damage Model for Lead-Free Solder journal August 2005
Quantitative analysis for hillocks grown from electroplated Sn film journal April 2010
Inferring dynamic recrystallization in ferrite using the kinetics of static recrystallization journal July 2002
Predicting the critical strain for dynamic recrystallization using the kinetics of static recrystallization journal July 2000
An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis journal November 2010
Hollow tin/chromium whiskers journal May 2010
Tin whisker studies. observation of some hollow whiskers and some sharply irregular external forms journal January 1956
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study journal July 2009
A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion journal May 2009
Crystallographic Characterization of Whiskers using EBSD journal July 2011
Thermal strain in lead thin films V: Strain relaxation above room temperature journal March 1980
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model journal July 2009
Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization journal May 2012
The internal stress in thin silver, copper and gold films journal July 1985

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