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Title: Low profile, highly configurable, current sharing paralleled wide band gap power device power module

Abstract

A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.

Inventors:
; ; ; ; ; ;
Publication Date:
Research Org.:
Cree Fayetteville, Inc. Fayetteville, AR (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1303252
Patent Number(s):
9,426,883
Application Number:
14/609,629
Assignee:
Cree Fayetteville, Inc. (Fayetteville, AR) DOEEE
DOE Contract Number:  
EE0006429
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Jan 30
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 24 POWER TRANSMISSION AND DISTRIBUTION

Citation Formats

McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, and Berry, Tony M. Low profile, highly configurable, current sharing paralleled wide band gap power device power module. United States: N. p., 2016. Web.
McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, & Berry, Tony M. Low profile, highly configurable, current sharing paralleled wide band gap power device power module. United States.
McPherson, Brice, Killeen, Peter D., Lostetter, Alex, Shaw, Robert, Passmore, Brandon, Hornberger, Jared, and Berry, Tony M. Tue . "Low profile, highly configurable, current sharing paralleled wide band gap power device power module". United States. doi:. https://www.osti.gov/servlets/purl/1303252.
@article{osti_1303252,
title = {Low profile, highly configurable, current sharing paralleled wide band gap power device power module},
author = {McPherson, Brice and Killeen, Peter D. and Lostetter, Alex and Shaw, Robert and Passmore, Brandon and Hornberger, Jared and Berry, Tony M},
abstractNote = {A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 23 00:00:00 EDT 2016},
month = {Tue Aug 23 00:00:00 EDT 2016}
}

Patent:

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