Improved monitoring of corrosion processes
Journal Article
·
· Journal of the American Water Works Association
OSTI ID:128827
- Gray and Osborne, Inc., Seattle, WA (United States)
- Univ. of Washington, Seattle, WA (United States). Dept. of Civil Engineering
The effect of orthophosphate addition (1 mg/L as P) on copper and lead-tin solder corrosion was monitored using an experimental coupon exposure apparatus with measurement by standing water metals analysis, gravimetric analysis, direct galvanic current metering, and potentiodynamic scan analysis. Orthophosphate addition appeared to have a significant effect on lead-tin solder corrosion although the results of each analysis differed in magnitude. The effect of orthophosphate addition on copper corrosion was less clear with gravimetric analysis showing a significant effect, whereas metals release analysis showed only a slight effect.
- OSTI ID:
- 128827
- Journal Information:
- Journal of the American Water Works Association, Journal Name: Journal of the American Water Works Association Journal Issue: 11 Vol. 87; ISSN 0003-150X; ISSN JAWWA5
- Country of Publication:
- United States
- Language:
- English
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