Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Bipolaron Hopping Conduction in Boron Carbides

Journal Article · · Physica Status Solidi
OSTI ID:12682

The electrical conductivities of boron carbides, B{sub 12+x}C{sub 3{minus}x} with 0.1 < x < 1.7, between 300 and 1200K suggest the hopping of a nearly temperature-independent density of small (bi)polarons. The activation energies of the nobilities are low, {approx} 0.16 eV, and are nearly independent of the composition. At lower temperatures, conductivities have non-Arrhenius temperature dependencies and strong sensitivity to carbon concentration. Percolative aspects of low-temperature hopping are evident in this sensitivity to composition. Boron carbides' Seebeck coefficients are anomalous in that (1) they are much larger than expected from boron carbides' large carrier densities and (2) they depend only weakly on the carrier density. Carrier-induced softening of local vibrations gives contributions to the Seebeck coefficient that mirror the magnitudes and temperature dependencies found in boron carbides.

Research Organization:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
12682
Report Number(s):
SAND99-2415J
Journal Information:
Physica Status Solidi, Journal Name: Physica Status Solidi
Country of Publication:
United States
Language:
English

Similar Records

Conductivities and Seebeck coefficients of boron carbides: Softening bipolaron hopping
Journal Article · Wed Aug 01 00:00:00 EDT 2001 · Physical Review B · OSTI ID:40277259

Conductivities and Seebeck Coefficients of Boron Carbides: ''Softening-Bipolaron'' Hopping
Journal Article · Thu Jul 20 00:00:00 EDT 2000 · Physical Review B · OSTI ID:759968

Large Enhancement of Boron Carbides{close_quote} Seebeck Coefficients through Vibrational Softening
Journal Article · Tue Sep 01 00:00:00 EDT 1998 · Physical Review Letters · OSTI ID:663113