Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Characterization and Modeling To Develop Embedded Heaters for Multilayer Microelectronic Packaging.

Conference ·
OSTI ID:1264056

Abstract not provided.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1264056
Report Number(s):
SAND2006-6330C; 525018
Country of Publication:
United States
Language:
English

Similar Records

Design Fabrication and Characterization of Embedded Resistor Heaters for Die Attach on a Multilayer Low Temperature Cofired Ceramic Package.
Conference · Fri Feb 29 23:00:00 EST 2008 · OSTI ID:1145711

Additive Manufacturing for Embedded Microelectronics.
Conference · Tue Aug 01 00:00:00 EDT 2017 · OSTI ID:1464909

Microelectronics package design using experimentally-validated modeling and simulation.
Conference · Mon Nov 01 00:00:00 EDT 2010 · OSTI ID:1030348

Related Subjects