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Title: System and method for interfacing large-area electronics with integrated circuit devices

Patent ·
OSTI ID:1261601
; ; ;

A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.

Research Organization:
Princeton Univ., NJ (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0004261
Assignee:
The Trustees of Princeton University (Princeton, NJ)
Patent Number(s):
9,391,220
Application Number:
13/367,856
OSTI ID:
1261601
Resource Relation:
Patent File Date: 2012 Feb 07
Country of Publication:
United States
Language:
English

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Photonic crystals for monitoring fatigue phenomena in steel structures
  • Zonta, Daniele; Chiappini, Andrea; Chiasera, Alessandro
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conference March 2009
Elastically Tunable Self-Organized Organic Lasers journal January 2011
Materials and Applications for Large Area Electronics: Solution-Based Approaches journal January 2010
A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications journal June 2004
Organic Semiconductor Devices with Enhanced Field and Environmental Responses for Novel Applications journal July 2008
Electroluminescent flexible film for product packaging patent October 2003
Scan testing system for circuits under test patent June 2010
Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites patent-application June 2004
Large-area nanoenabled macroelectronic substrates and uses therefor patent-application April 2005
Deformable organic devices patent-application August 2006

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