Finite-element analysis of transverse compressive and thermal loads on Nb3Sn wires with voids
- Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)
- Univ. of California, Santa Cruz, CA (United States). Dept. of Physics
- Univ. of Geneva (Switzerland) Dept Quantum Matter Phys; Univ. of Geneva (Switzerland) Dept Appl Phys
High-field superconducting magnets play a very important role in many large-scale physics experiments, particularly particle colliders and fusion confinement devices such as Large Hadron Collider (LHC) and International Thermonuclear Experimental Reactor (ITER). The two most common superconductors used in these applications are NbTi and Nb3Sn. Nb3Sn wires are favored because of their significantly higher Jc (critical current density) for higher field applications. The main disadvantage of Nb3Sn is that the superconducting performance of the wire is highly strain sensitive and it is very brittle. This strain sensitivity is strongly influenced by two factors: plasticity and cracked filaments. Cracks are induced by large stress concentrators that can be traced to the presence of voids in the wire. We develop detailed 2-D and 3-D finite-element models containing wire filaments and different possible distributions of voids in a bronze-route Nb3Sn wire. We apply compressive transverse loads for various cases of void distributions to simulate the stress and strain response of a Nb3Sn wire under the Lorentz force. Furthermore, this paper improves our understanding of the effect voids have on the Nb3Sn wire's mechanical properties, and in so, the connection between the distribution of voids and performance degradation such as the correlation between irreversible strain limit and the void-induced local stress concentrations.
- Research Organization:
- Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC02-09CH11466
- OSTI ID:
- 1256389
- Report Number(s):
- PPPL-5207
- Journal Information:
- IEEE Transactions on Applied Superconductivity, Vol. 26, Issue 4; ISSN 1051-8223
- Publisher:
- Institute of Electrical and Electronics Engineers (IEEE)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
Web of Science
Quantitative correlation between the void morphology of niobium-tin wires and their irreversible critical current degradation upon mechanical loading
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journal | April 2018 |
Influence of transverse stress exerted at room temperature on the superconducting properties of Nb 3 Sn wires
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journal | August 2019 |
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