Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters
We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.
- Research Organization:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- DOE Contract Number:
- AC36-08GO28308
- OSTI ID:
- 1251105
- Report Number(s):
- NREL/CP-5J00-63642
- Resource Relation:
- Conference: Presented at the 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC), 14-19 June 2015, New Orleans, Louisiana; Related Information: Proceedings of the 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC), 14-19 June 2015, New Orleans, Louisiana
- Country of Publication:
- United States
- Language:
- English
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