A kinetic model for stress generation in thin films grown from energetic vapor fluxes

Chason, E.; Karlson, M.; Colin, J. J.; Magnfält, D.; Sarakinos, K.; Abadias, G.

doi:10.1063/1.4946039

Title: A kinetic model for stress generation in thin films grown from energetic vapor fluxes

Journal Article · Wed Apr 13 00:00:00 EDT 2016 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.4946039· OSTI ID:1470756

Chason, E. ^[1]; Karlson, M. ^[1]; Colin, J. J. ^[2];

^[3];

^[3]; Abadias, G. ^[2]

Brown Univ., Providence, RI (United States). School of Engineering
Univ. of Poitiers and National School of Mechanics and Aerotechnics (ENSMA), CNRS, Chasseneuil-du-Poitou (France). Inst. P (Pprime) and Dept. of Physics and Mechanics of Materials
Linkoping Univ. (Sweden). Nanoscale Engineering Division and Dept. of Physics, Chemistry and Biology

We have developed a kinetic model for residual stress generation in thin films grown from energetic vapor fluxes, encountered, e.g., during sputter deposition. This new analytical model considers sub-surface point defects created by atomic peening, along with processes treated in already existing stress models for non-energetic deposition, i.e., thermally activated diffusion processes at the surface and the grain boundary. According to the new model, ballistically induced subsurface defects can get incorporated as excess atoms at the grain boundary, remain trapped in the bulk, or annihilate at the free surface, resulting in a complex dependence of the steady-state stress on the grain size, the growth rate, as well as the energetics of the incoming particle flux. We compare calculations from the model with in situ stress measurements performed on a series of Mo films sputter-deposited at different conditions and having different grain sizes. The model is able to reproduce the observed increase of compressive stress with increasing growth rate, behavior that is the opposite of what is typically seen under non-energetic growth conditions. On a grander scale, this study is a step towards obtaining a comprehensive understanding of stress generation and evolution in vapor deposited polycrystalline thin films.

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Research Organization:: Brown Univ., Providence, RI (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0008799

OSTI ID:: 1470756

Alternate ID(s):: OSTI ID: 1247217

Journal Information:: Journal of Applied Physics, Vol. 119, Issue 14; ISSN 0021-8979

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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