Silicon-Copper Helical Arrays for New Generation Lithium Ion Batteries

Journal Article · Tue Sep 22 04:00:00 EDT 2015 · Nano Letters

DOI:https://doi.org/10.1021/acs.nanolett.5b02522· OSTI ID:1244552

Polat, B. D.; Keles, O; Amine, K

The helical array (with 10 atom % Cu) exhibits 3130 mAh g–1 with 83% columbic efficiency and retains 83% of its initial discharge capacity after 100th cycle. Homogeneously distributed interspaces between the helical arrays accommodate high volumetric changes upon cycling and copper atoms form a conductive network to buffer the mechanical stress generated in the electrode while minimizing electrochemical agglomeration of Si. Also, ion assistance is believed to enhance the density of the helices at the bottom thus increasing the adhesion

• Research Organization: Argonne National Laboratory (ANL)
• Sponsoring Organization: Scientific and Technological Research Council of Turkey (TUBITAK)
• DOE Contract Number: AC02-06CH11357
• OSTI ID: 1244552
• Journal Information: Nano Letters, Journal Name: Nano Letters Journal Issue: 10 Vol. 15; ISSN 1530-6984
• Publisher: American Chemical Society
• Country of Publication: United States
• Language: English

Related Subjects

CuSi thin film
Lithium-ion batteries
anode
glancing angle deposition
helices
ion-assisted deposition