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Local residual stress monitoring of aluminum nitride MEMS using UV micro-Raman spectroscopy

Journal Article · · Journal of Micromechanics and Microengineering. Structures, Devices and Systems
 [1];  [2]
  1. The Pennsylvania State Univ., University Park, PA (United States)
  2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Localized stress variation in aluminum nitride (AlN) sputtered on patterned metallization has been monitored through the use of UV micro-Raman spectroscopy. This technique utilizing 325 nm laser excitation allows detection of the AlN E2(high) phonon mode in the presence of metal electrodes beneath the AlN layer with a high spatial resolution of less than 400 nm. The AlN film stress shifted 400 MPa from regions where AlN was deposited over a bottom metal electrode versus silicon dioxide. Thus, across wafer stress variations were also investigated showing that wafer level stress metrology, for example using wafer curvature measurements, introduces large uncertainties for predicting the impact of AlN residual stress on the device performance.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1239984
Alternate ID(s):
OSTI ID: 22508841
Report Number(s):
SAND--2015-10886J; 617639
Journal Information:
Journal of Micromechanics and Microengineering. Structures, Devices and Systems, Journal Name: Journal of Micromechanics and Microengineering. Structures, Devices and Systems Journal Issue: 2 Vol. 26; ISSN 0960-1317
Publisher:
IOP PublishingCopyright Statement
Country of Publication:
United States
Language:
English

References (14)

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Analysis of the residual stress distribution in AlGaN/GaN high electron mobility transistors journal March 2013
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Effect of particle bombardment on the orientation and the residual stress of sputtered AlN films for SAW devices journal March 2004
CMOS-compatible AlN piezoelectric micromachined ultrasonic transducers conference September 2009
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Stress dependence of reactively sputtered aluminum nitride thin films on sputtering parameters
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  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 7, Issue 3 https://doi.org/10.1116/1.575923
journal May 1989

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Amorphous Silicon Self‐Rolling Micro Electromechanical Systems: From Residual Stress Control to Complex 3D Structures journal August 2019

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