Sandia/Stanford Unified Creep Plasticity Damage Model for ANSYS

Software · Sun Sep 03 00:00:00 EDT 2006

OSTI ID:1231098

Pierce, David M.; Vianco, Paul T.; Fossum, Arlo F.

A unified creep plasticity (UCP) model was developed, based upon the time-dependent and time-independent deformation properties of the 95.5Sn-3.9Ag-0.6Cu (wt.%) soldier that were measured at Sandia. Then, a damage parameter, D, was added to the equation to develop the unified creep plasticity damage (UCPD) model. The parameter, D, was parameterized, using data obtained at Sandia from isothermal fatigue experiments on a double-lap shear test. The softwae was validated against a BGA solder joint exposed to thermal cycling. The UCPD model was put into the ANSYS finite element as a subroutine. So, the softwae is the subroutine for ANSYS 8.1.

• Short Name / Acronym: UCPD; 002262IBMPC00
• Version: 00
• Programming Language(s): Medium: X; OS: Windows XP Professional (2002); Compatibility: IBM PC
• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-094AL85000
• OSTI ID: 1231098
• Country of Origin: United States