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New functionalized block copolymers for bonding copper to epoxy

Technical Report ·
DOI:https://doi.org/10.2172/119982· OSTI ID:119982

The authors are exploring the use of functionalized block copolymers for bonding copper to epoxy in printed wiring boards. The program involves four key elements: (i) synthesis of suitable functionalized block copolymers; (ii) characterization of the conformation of the copolymers at the relevant interfaces by neutron reflectivity; (iii) spectroscopic measurements of chemical bonding, and (iv) measurement of the mechanical properties of the interfaces. The copolymers are synthesized by living, ring-opening metathesis polymerization. This relatively new technique allows great flexibility for synthesis of functionalized block copolymers in that the initiators are relatively insensitive to a wide range of functional groups. Significant adhesion enhancement has been observed in lap shear tests.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States); Argonne National Lab., IL (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000; W-31109-ENG-38
OSTI ID:
119982
Report Number(s):
SAND--95-2292C; CONF-951033--22; ON: DE96001758
Country of Publication:
United States
Language:
English