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Title: Identification of a potential superhard compound ReCN

Journal Article · · Journal of Alloys and Compounds
 [1];  [1];  [2];  [1];  [1]
  1. Jilin Univ., Changchun (China)
  2. Jilin Univ., Changchun (China); Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Here, we identify a new ternary compound, ReCN and characterize its properties including structural stability and indicators of hardness using first principles calculations. Furthermore, we find that there are two stable structures with space groups P63mc (HI) and P3m1 (HII), in which there are no C–C and N–N bonds. Both structures, H1 and III are elastically and dynamically stable. The electronic structures show that ReCN is a semiconductor, although the parent compounds, ReC2 and ReN2 are both metallic. ReCN is found to possess the outstanding mechanical properties with the large bulk modulus, shear modulus and excellent ideal strengths. Additionally, ReCN may perhaps be synthesized relatively easily because it becomes thermodynamic stable with respect to decomposition at very low pressures.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1185687
Alternate ID(s):
OSTI ID: 1250205
Journal Information:
Journal of Alloys and Compounds, Vol. 631, Issue C; ISSN 0925-8388
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 9 works
Citation information provided by
Web of Science

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Cited By (4)

Mechanochemical synthesis and annealing of tungsten di‐ and tetra‐boride journal September 2019
Electronic structure calculations for rhenium carbonitride: an extended Hückel tight-binding study journal October 2018
First-principle investigation of the structural, electronic, elastic, and elastic anisotropy properties and thermal stabilities of CeMg 2 Si 2 and Mg 2 Si journal September 2019
Ab-initio study of ReCN in the bulk and as a new two dimensional material journal June 2017