Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors

Joshi, Pooran C.; Kuruganti, Teja; Killough, Stephen M.

doi:10.1149/2.0161504jss

Impact of pulse thermal processing on the properties of inkjet printed metal and flexible sensors

Journal Article · Wed Mar 11 00:00:00 EDT 2015 · ECS Journal of Solid State Science and Technology

DOI:https://doi.org/10.1149/2.0161504jss· OSTI ID:1185477

Joshi, Pooran C. ^[1]; Kuruganti, Teja ^[1]; Killough, Stephen M. ^[1]

Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

In this paper, we report on the low temperature processing of environmental sensors employing pulse thermal processing (PTP) technique to define a path toward flexible sensor technology on plastic, paper, and fabric substrates. Inkjet printing and pulse thermal processing technique were used to realize mask-less, additive integration of low-cost sensors on polymeric substrates with specific focus on temperature, humidity, and strain sensors. The printed metal line performance was evaluated in terms of the electrical conductivity characteristics as a function of post-deposition thermal processing conditions. The PTP processed Ag metal lines exhibited high conductivity with metal sheet resistance values below 100 mΩ/{whitesquare} using a pulse width as short as 250 μs. The flexible temperature and relative humidity sensors were defined on flexible polyimide substrates by direct printing of Ag metal structures. The printed resistive temperature sensor and capacitive humidity sensor were characterized for their sensitivity with focus on future smart-building applications. Strain gauges were printed on polyimide substrate to determine the mechanical properties of the silver nanoparticle films. Finally, the observed electrical properties of the printed metal lines and the sensitivity of the flexible sensors show promise for the realization of a high performance print-on-demand technology exploiting low thermal-budget PTP technique.

View Accepted Manuscript (DOE)

Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Laboratory Directed Research and Development (LDRD) Program; USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Building Technologies Office

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1185477

Journal Information:: ECS Journal of Solid State Science and Technology, Journal Name: ECS Journal of Solid State Science and Technology Journal Issue: 4 Vol. 4; ISSN 2162-8769

Publisher:: Electrochemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

References (30)

Highly Sensitive Skin-Mountable Strain Gauges Based Entirely on Elastomers Lu, Nanshu; Lu, Chi; Yang, Shixuan Advanced Functional Materials, Vol. 22, Issue 19, p. 4044-4050 https://doi.org/10.1002/adfm.201200498	journal	June 2012
Embedded 3D Printing of Strain Sensors within Highly Stretchable Elastomers Muth, Joseph T.; Vogt, Daniel M.; Truby, Ryan L. Advanced Materials, Vol. 26, Issue 36, p. 6307-6312 https://doi.org/10.1002/adma.201400334	journal	June 2014
All-Inkjet-Printed, All-Air-Processed Solar Cells Jung, Sungjune; Sou, Antony; Banger, Kulbinder Advanced Energy Materials, Vol. 4, Issue 14 https://doi.org/10.1002/aenm.201400432	journal	May 2014
30.2: Invited Paper : Advancements in Inkjet Printing for OLED Mass Production Madigan, Conor F.; Hauf, Chris R.; Barkley, Lucas D. SID Symposium Digest of Technical Papers, Vol. 45, Issue 1 https://doi.org/10.1002/j.2168-0159.2014.tb00108.x	journal	June 2014
Pulse-thermal processing for electronic applications Ott, Ronald JOM, Vol. 58, Issue 6 https://doi.org/10.1007/s11837-006-0176-8	journal	June 2006
Why Do We Use So Much Energy, and What For? Sioshansi, Fereidoon P. Energy, Sustainability and the Environment https://doi.org/10.1016/B978-0-12-385136-9.10001-4	book	January 2011
3-D printing: The new industrial revolution Berman, Barry Business Horizons, Vol. 55, Issue 2 https://doi.org/10.1016/j.bushor.2011.11.003	journal	March 2012
Flexible embedded circuitry: A novel process for high density, cost effective electronics van den Brand, Jeroen; Kusters, Roel; Barink, Marco Microelectronic Engineering, Vol. 87, Issue 10 https://doi.org/10.1016/j.mee.2009.11.004	journal	October 2010
Inkjetting dielectric layer for electronic applications Kaija, Kimmo; Pekkanen, Ville; Mäntysalo, Matti Microelectronic Engineering, Vol. 87, Issue 10 https://doi.org/10.1016/j.mee.2009.12.028	journal	October 2010
Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes Zhao, Da; Liu, Tao; Park, Jin Gyu Microelectronic Engineering, Vol. 96 https://doi.org/10.1016/j.mee.2012.03.004	journal	August 2012
Low temperature nanoparticle sintering with continuous wave and pulse lasers Kumpulainen, Tero; Pekkanen, Jussi; Valkama, Jani Optics & Laser Technology, Vol. 43, Issue 3 https://doi.org/10.1016/j.optlastec.2010.08.002	journal	April 2011
Flexible, plastic transistor-based chemical sensors Roberts, Mark E.; Mannsfeld, Stefan C. B.; Stoltenberg, Randall M. Organic Electronics, Vol. 10, Issue 3 https://doi.org/10.1016/j.orgel.2008.12.001	journal	May 2009
Why Going Towards Plastic and Flexible Sensors? Briand, Danick; Molina-Lopez, Francisco; Quintero, Andrés Vásquez Procedia Engineering, Vol. 25 https://doi.org/10.1016/j.proeng.2011.12.004	journal	January 2011
Inkjet printing of 3D metal–insulator–metal crossovers Sanchez-Romaguera, Veronica; Madec, Marie-Beatrice; Yeates, Stephen G. Reactive and Functional Polymers, Vol. 68, Issue 6 https://doi.org/10.1016/j.reactfunctpolym.2008.02.007	journal	June 2008
IR-sintering of ink-jet printed metal-nanoparticles on paper Tobjörk, Daniel; Aarnio, Harri; Pulkkinen, Petri Thin Solid Films, Vol. 520, Issue 7 https://doi.org/10.1016/j.tsf.2011.10.017	journal	January 2012
Fully Printed, Highly Sensitive Multifunctional Artificial Electronic Whisker Arrays Integrated with Strain and Temperature Sensors Harada, Shingo; Honda, Wataru; Arie, Takayuki ACS Nano, Vol. 8, Issue 4 https://doi.org/10.1021/nn500845a	journal	March 2014
Transparent conductors composed of nanomaterials Layani, Michael; Kamyshny, Alexander; Magdassi, Shlomo Nanoscale, Vol. 6, Issue 11 https://doi.org/10.1039/c4nr00102h	journal	January 2014
Air stable high resolution organic transistors by selective laser sintering of ink-jet printed metal nanoparticles Ko, Seung H.; Pan, Heng; Grigoropoulos, Costas P. Applied Physics Letters, Vol. 90, Issue 14 https://doi.org/10.1063/1.2719162	journal	April 2007
Generation of nitrogen acceptors in ZnO using pulse thermal processing Xu, Jun; Ott, Ronald; Sabau, Adrian S. Applied Physics Letters, Vol. 92, Issue 15 https://doi.org/10.1063/1.2911725	journal	April 2008
Review Article: Methods for Fault Detection, Diagnostics, and Prognostics for Building Systems—A Review, Part I Katipamula, Srinivas; Brambley, Michael HVAC&R Research, Vol. 11, Issue 1 https://doi.org/10.1080/10789669.2005.10391123	journal	January 2005
Development of inkjet printed strain sensors Correia, V.; Caparros, C.; Casellas, C. Smart Materials and Structures, Vol. 22, Issue 10 https://doi.org/10.1088/0964-1726/22/10/105028	journal	September 2013
A highly sensitive 3D-shaped tactile sensor Koiva, Risto; Zenker, Matthias; Schurmann, Carsten 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) https://doi.org/10.1109/AIM.2013.6584238	conference	July 2013
Large Area Electronics Using Printing Methods Parashkov, R.; Becker, E.; Riedl, T. Proceedings of the IEEE, Vol. 93, Issue 7 https://doi.org/10.1109/JPROC.2005.850304	journal	July 2005
RFID Tag and RF Structures on a Paper Substrate Using Inkjet-Printing Technology Yang, Li; Rida, Amin; Vyas, Rushi IEEE Transactions on Microwave Theory and Techniques, Vol. 55, Issue 12, p. 2894-2901 https://doi.org/10.1109/TMTT.2007.909886	journal	December 2007
All-printed smart structures: a viable option? O'Donnell, John; Ahmadkhanlou, Farzad; Yoon, Hwan-Sik SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, SPIE Proceedings https://doi.org/10.1117/12.2045284	conference	March 2014
High resolution patterning for flexible electronics via roll-to-roll nanoimprint lithography Sabik, Sami; de Riet, Joris; Yakimets, Iryna SPIE Advanced Lithography, SPIE Proceedings https://doi.org/10.1117/12.2046479	conference	March 2014
Challenges and perspectives of printed electronics Schmidt, G.; Kempa, H.; Fuegmann, U. SPIE Optics + Photonics, SPIE Proceedings https://doi.org/10.1117/12.680256	conference	August 2006
Printed electronic on flexible and glass substrates Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2010, SPIE Proceedings https://doi.org/10.1117/12.872239	conference	September 2010
Standard Practice for Evaluating Ink or Coating Adhesion to Flexible Packaging Materials Using Tape--ASTM F2252/F2252M-13(2018) No authors listed ASTM Book of Standards Volume: 15.10 https://doi.org/10.1520/F2252_F2252M	standard	November 2018
Organic Semiconductor Devices with Enhanced Field and Environmental Responses for Novel Applications Someya, Takao; Pal, Bholanath; Huang, Jia MRS Bulletin, Vol. 33, Issue 7 https://doi.org/10.1557/mrs2008.141	journal	July 2008

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36 MATERIALS SCIENCE
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