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Title: Textured substrate tape and devices thereof

Patent ·
OSTI ID:1175860

A method for forming a sharply biaxially textured substrate, such as a single crystal substrate, includes the steps of providing a deformed metal substrate, followed by heating above the secondary recrystallization temperature of the deformed substrate, and controlling the secondary recrystallization texture by either using thermal gradients and/or seeding. The seed is selected to shave a stable texture below a predetermined temperature. The sharply biaxially textured substrate can be formed as a tape having a length of 1 km, or more. Epitaxial articles can be formed from the tapes to include an epitaxial electromagnetically active layer. The electromagnetically active layer can be a superconducting layer.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-00OR22725
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Number(s):
7,087,113
Application Number:
10/189,678
OSTI ID:
1175860
Country of Publication:
United States
Language:
English

References (12)

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Weak link behavior of grain boundaries in Nd‐, Bi‐, and Tl‐based cuprate superconductors journal January 1993
High current YBa 2 Cu 3 O 7−δ thick films on flexible nickel substrates with textured buffer layers journal October 1994
The Superconducting Properties of [001] Twist Boundaries in a Bi-Sr-Ca-Cu-O Superconductor journal July 1992
Transport characteristics of Tl 2 Ba 2 CaCu 2 O 8 bicrystal grain boundary junctions at 77 K journal January 1993
Effect of oxygen pressure on the synthesis of YBa 2 Cu 3 O 7− x thin films by post‐deposition annealing journal May 1991
Reflection high-energy electron diffraction studies of epitaxial oxide seed-layer growth on rolling-assisted biaxially textured substrate Ni(001): The role of surface structure and chemistry journal November 2001
Conductors with controlled grain boundaries: An approach to the next generation, high temperature superconducting wire journal November 1997
Electromagnetic coupling character of [001] twist boundaries in sintered Bi2Sr2CaCu2O8+x bicrystals journal September 1994
Structural and transport properties of biaxially aligned YBa 2 Cu 3 O 7− x films on polycrystalline Ni‐based alloy with ion‐beam‐modified buffer layers journal August 1993