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Title: Thermally matched fluid cooled power converter

Abstract

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ;
Publication Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175403
Patent Number(s):
6,909,607
Application Number:
10/252,319
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
DOE Contract Number:  
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
30 DIRECT ENERGY CONVERSION

Citation Formats

Radosevich, Lawrence D., Kannenberg, Daniel G., Kaishian, Steven C., and Beihoff, Bruce C. Thermally matched fluid cooled power converter. United States: N. p., 2005. Web.
Radosevich, Lawrence D., Kannenberg, Daniel G., Kaishian, Steven C., & Beihoff, Bruce C. Thermally matched fluid cooled power converter. United States.
Radosevich, Lawrence D., Kannenberg, Daniel G., Kaishian, Steven C., and Beihoff, Bruce C. 2005. "Thermally matched fluid cooled power converter". United States. https://www.osti.gov/servlets/purl/1175403.
@article{osti_1175403,
title = {Thermally matched fluid cooled power converter},
author = {Radosevich, Lawrence D. and Kannenberg, Daniel G. and Kaishian, Steven C. and Beihoff, Bruce C.},
abstractNote = {A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
url = {https://www.osti.gov/biblio/1175403}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {6}
}