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Title: Method and apparatus for diamond wire cutting of metal structures

Patent ·
OSTI ID:1175321

A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO.sub.2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-76CH03073
Assignee:
The Trustees of Princeton University (Princeton, NJ)
Patent Number(s):
6,881,131
Application Number:
10/138,792
OSTI ID:
1175321
Country of Publication:
United States
Language:
English

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