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Title: High precision, rapid laser hole drilling

Patent ·
OSTI ID:1175264

A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.

Research Organization:
The Regents of the Univ. of California, Oakland, CA (United States); Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Number(s):
6,864,459
Application Number:
09/781,073
OSTI ID:
1175264
Country of Publication:
United States
Language:
English

References (1)

Precision micromachining with pulsed green lasers journal December 1998

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