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Title: Method for applying a photoresist layer to a substrate having a preexisting topology

Abstract

The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to "cure" or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.

Inventors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174694
Patent Number(s):
6,680,263
Application Number:
10/074,195
Assignee:
Sandia National Laboratories (Livermore, CA)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Morales, Alfredo M., and Gonzales, Marcela. Method for applying a photoresist layer to a substrate having a preexisting topology. United States: N. p., 2004. Web.
Morales, Alfredo M., & Gonzales, Marcela. Method for applying a photoresist layer to a substrate having a preexisting topology. United States.
Morales, Alfredo M., and Gonzales, Marcela. Tue . "Method for applying a photoresist layer to a substrate having a preexisting topology". United States. https://www.osti.gov/servlets/purl/1174694.
@article{osti_1174694,
title = {Method for applying a photoresist layer to a substrate having a preexisting topology},
author = {Morales, Alfredo M. and Gonzales, Marcela},
abstractNote = {The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to "cure" or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {1}
}

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