High thermal conductivity lossy dielectric using co-densified multilayer configuration
Patent
·
OSTI ID:1174377
Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-96OR22464
- Assignee:
- Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
- Patent Number(s):
- 6,579,393
- Application Number:
- 09/837,891
- OSTI ID:
- 1174377
- Country of Publication:
- United States
- Language:
- English
Similar Records
High thermal conductivity lossy dielectric using a multi layer configuration
Stability study of a gyrotron-traveling-wave amplifier based on a lossy dielectric-loaded mode-selective circuit
A General Strategy to Achieve Colossal Permittivity and Low Dielectric Loss Through Constructing Insulator/Semiconductor/Insulator Multilayer Structures
Patent
·
Wed Jan 01 00:00:00 EST 2003
·
OSTI ID:1174377
Stability study of a gyrotron-traveling-wave amplifier based on a lossy dielectric-loaded mode-selective circuit
Journal Article
·
Wed Jul 15 00:00:00 EDT 2009
· Physics of Plasmas
·
OSTI ID:1174377
A General Strategy to Achieve Colossal Permittivity and Low Dielectric Loss Through Constructing Insulator/Semiconductor/Insulator Multilayer Structures
Journal Article
·
Sat Sep 15 00:00:00 EDT 2018
· Journal of Low Temperature Physics
·
OSTI ID:1174377
+4 more