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Title: Interconnect assembly for an electronic assembly and assembly method therefor

Abstract

An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

Inventors:
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174358
Patent Number(s):
6,575,765
Application Number:
09/777,638
Assignee:
Delphi Technologies, Inc. (Troy, MI)
DOE Contract Number:  
AC36-98GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Gerbsch, Erich William. Interconnect assembly for an electronic assembly and assembly method therefor. United States: N. p., 2003. Web.
Gerbsch, Erich William. Interconnect assembly for an electronic assembly and assembly method therefor. United States.
Gerbsch, Erich William. Tue . "Interconnect assembly for an electronic assembly and assembly method therefor". United States. https://www.osti.gov/servlets/purl/1174358.
@article{osti_1174358,
title = {Interconnect assembly for an electronic assembly and assembly method therefor},
author = {Gerbsch, Erich William},
abstractNote = {An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {6}
}

Patent:

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