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Title: Polished polymide substrate

Abstract

Polymer substrates, in particular polyimide substrates, and polymer laminates for optical applications are described. Polyimide substrates are polished on one or both sides depending on their thickness, and single-layer or multi-layer waveguide structures are deposited on the polished polyimide substrates. Optical waveguide devices are machined by laser ablation using a combination of IR and UV lasers. A waveguide-fiber coupler with a laser-machined groove for retaining the fiber is also disclosed.

Inventors:
;
Publication Date:
Research Org.:
~Individually Owned Patent
Sponsoring Org.:
USDOE
OSTI Identifier:
1174329
Patent Number(s):
6,563,998
Application Number:
09/292,432
Assignee:
Farah, John; Sudarshanam, Venkatapuram S. OSTI
DOE Contract Number:  
FG02-90ER81033
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Farah, John, and Sudarshanam, Venkatapuram S. Polished polymide substrate. United States: N. p., 2003. Web.
Farah, John, & Sudarshanam, Venkatapuram S. Polished polymide substrate. United States.
Farah, John, and Sudarshanam, Venkatapuram S. Tue . "Polished polymide substrate". United States. https://www.osti.gov/servlets/purl/1174329.
@article{osti_1174329,
title = {Polished polymide substrate},
author = {Farah, John and Sudarshanam, Venkatapuram S.},
abstractNote = {Polymer substrates, in particular polyimide substrates, and polymer laminates for optical applications are described. Polyimide substrates are polished on one or both sides depending on their thickness, and single-layer or multi-layer waveguide structures are deposited on the polished polyimide substrates. Optical waveguide devices are machined by laser ablation using a combination of IR and UV lasers. A waveguide-fiber coupler with a laser-machined groove for retaining the fiber is also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 13 00:00:00 EDT 2003},
month = {Tue May 13 00:00:00 EDT 2003}
}

Patent:

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