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Title: Focal plane array with modular pixel array components for scalability

Abstract

A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1165103
Patent Number(s):
8,907,439
Application Number:
13/163,909
Assignee:
Sandia Corporation (Albuquerque, NM) SSO
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Jun 20
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION; 42 ENGINEERING

Citation Formats

Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, and Holmes, Michael L. Focal plane array with modular pixel array components for scalability. United States: N. p., 2014. Web.
Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, & Holmes, Michael L. Focal plane array with modular pixel array components for scalability. United States.
Kay, Randolph R, Campbell, David V, Shinde, Subhash L, Rienstra, Jeffrey L, Serkland, Darwin K, and Holmes, Michael L. Tue . "Focal plane array with modular pixel array components for scalability". United States. https://www.osti.gov/servlets/purl/1165103.
@article{osti_1165103,
title = {Focal plane array with modular pixel array components for scalability},
author = {Kay, Randolph R and Campbell, David V and Shinde, Subhash L and Rienstra, Jeffrey L and Serkland, Darwin K and Holmes, Michael L},
abstractNote = {A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 09 00:00:00 EST 2014},
month = {Tue Dec 09 00:00:00 EST 2014}
}

Patent:

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