Effect of microstructure on material-removal mechanisms and damage tolerance in abrasive machining of silicon carbide
Journal Article
·
· Journal of the American Ceramic Society
- National Inst. of Standards and Technology, Gaithersburg, MD (United States). Ceramics Div.
Effects of microstructural heterogeneity on material-removal mechanisms and damage-formation processes in the abrasive machining of silicon carbide are investigated. It is shown that the process of material removal in a conventional silicon carbide material with equiaxed-grain microstructure and strong grain boundaries consists of the formation and propagation of transgranular cracks which results in macroscopic chipping. However, in a silicon carbide material, containing 20 vol% yttrium aluminum garnet (YAG) second phase, with elongated-grain microstructure and weak grain boundaries, intergranular microcracks are formed at the interphase boundaries, leading to dislodgement of individual grains. These different mechanisms of material-removal affect the nature of machining-induced damage. While in the conventional silicon carbide material the machining damage consists of transgranular median/radial cracks, in the heterogeneous silicon carbide material, abrasive machining produces interfacial microcracks distributed within a thin surface layer. These two distinct types of machining damage result in a different strength response in the two forms of silicon carbide materials. In the case of the conventional silicon carbide, grinding damage results in a dramatic decrease in strength relative to the as-polished specimens. In contrast, the ground heterogeneous silicon carbide specimens show no strength loss at all.
- OSTI ID:
- 116097
- Journal Information:
- Journal of the American Ceramic Society, Journal Name: Journal of the American Ceramic Society Journal Issue: 9 Vol. 78; ISSN 0002-7820; ISSN JACTAW
- Country of Publication:
- United States
- Language:
- English
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