Laser soldering of Sn-Ag solder
In recent years, there has been pressure from federal and state environmental agencies to find substitutes for Pb-containing solders. Our research team has been studying SnAg solder as a possible alternative. in comparison to Sn-Pb solder, SnAg poses less of an environmental threat and can be used for higher temperature applications such as in avionics or under the hood in automobiles. Our study also compares the processes of laser and IR reflow soldering and their effects on microstructure, microstructure stability, and mechanical and thermomechanical properties of joints. Several laser soldered joints were produced by varying beam power and scan rate. Microhardness was measured and joint microstructure analyzed in order to find the optimum parameters. Laser soldered joints with optimum parameters were then exposed to temperatures between 40{degrees}C and 190{degrees}C for times up to 300 days along with conventional IR reflowed joints. The purpose was to determine the long term microstructural stability and mechanical reliability of the joints for the two processes. The results obtained show that there is a processing window where good quality laser solder joints can be produced. Our study also revealed that, initially, laser-produced joints differed significantly in microstructural details and were superior to IR reflowed joints in both microhardness and microstructure. As the samples were aged, it was observed that the microstructures and microhardnesses became increasingly similar. Finally, after significant aging, voids were found at the intermetallic layers formed at Cu or Cu alloy substrates and the joints began to fail.
- OSTI ID:
- 115548
- Report Number(s):
- CONF-9404233--
- Country of Publication:
- United States
- Language:
- English
Similar Records
Laser versus IR reflow soldering of eutectic tin-silver solder
Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder