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Pore Corrosion Model for Gold-Plated Copper Contacts.

Journal Article · Tue May 01 00:00:00 EDT 2007 · IEEE Transactions on Components Packaging and Technologies

DOI:https://doi.org/10.1109/TCAPT.2007.906340· OSTI ID:1147901

Sun, Amy Cha-Tien; Moffat, Harry K.; Enos, David; George, Carly S.

Abstract not provided.

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Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1147901

Report Number(s):: SAND2007-3233J; 523027

Journal Information:: IEEE Transactions on Components Packaging and Technologies, Journal Name: IEEE Transactions on Components Packaging and Technologies Journal Issue: 4 Vol. 30; ISSN 1521-3331

Country of Publication:: United States

Language:: English

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