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Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free Solder.

Journal Article · Sun Jul 01 00:00:00 EDT 2007 · IEEE Journal of Electronic Packaging

OSTI ID:1147408

Vianco, Paul T.; Neilsen, Michael K. ^[1]; Pierce, David M.; Sheppard, Sheri D.; Fossum, Arlo F.

Sandia National Laboratories, Kansas City, MO

Abstract not provided.

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Research Organization:: Sandia National Laboratories Kansas City, MO; Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1147408

Report Number(s):: SAND2007-4837J; 522139

Journal Information:: IEEE Journal of Electronic Packaging, Journal Name: IEEE Journal of Electronic Packaging

Country of Publication:: United States

Language:: English

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