Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)

Conference · Sun Oct 09 04:00:00 EDT 2011

OSTI ID:1134030

Wolf, J. Ambrose; Vianco, P. T.; Johnson, M. H.; Goldammer, S.

Thin film multilayers have previously been introduced on multilayer low temperature cofired ceramic (LTCC). The ruggedness of a multipurpose Ti-Cu-Pt-Au stack has continued to benefit fabrication and reliability in state-of-theart modules. Space optimization is described, preserving miniaturization of critical spaces and component pads. Additional soldering details are also presented, including trends with solder-stop materials. Feature compensation becomes a simple step in the normal manufacturing flow which enables exact targeting of desired feature sizes. In addition, fine details of the manufacturing process, including ion milling, will be discussed. We will discuss full long-term aging results and structural details that reinforce the reliability and function. Different thin film materials for specific applications can be exploited for additional capabilities such as filters and other integral components. Cross sections verify the results shown. This successful integration of thin films on LTCC points to higher frequencies which require finer lines and spaces. Advancements of these applications become possible due to the associated progression of smaller skin depth and thinner metallic material.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• Contributing Organization: Sandia National Laboratories, Albuquerque, NM
• DOE Contract Number: NA0000622
• OSTI ID: 1134030
• Report Number(s): KCP-613-9002
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
LTCC
thin film
PVD