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UCPD Model for Pb-Free Solder

Journal Article · · Journal of Electronic Packaging
DOI:https://doi.org/10.1115/1.4026851· OSTI ID:1109422
;
Abstract not provided.
Research Organization:
Sandia National Laboratories Albuquerque, NM; Sandia National Laboratories
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1109422
Report Number(s):
SAND2013-7526J; 473627
Journal Information:
Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 4 Vol. 136; ISSN 1043-7398
Country of Publication:
United States
Language:
English

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